Stacked integrated circuit package system with connection protection
AssigneeSTATS ChipPAC, Ltd.
InventorsHyun Joung Kim, Jong Wook Ju, Taeg Ki Lim
Life of this patent
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Abstract
A stacked integrated circuit package system is provided connecting an interconnect between a first integrated circuit device and a substrate, the first integrated circuit device on the substrate, applying a protective dot on the first integrated circuit device, mounting a second integrated circuit device, having an adhesive, on the protective dot, with the adhesive on the first integrated circuit device, connecting the second integrated circuit device and the substrate, and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.
Claims20
A stacked integrated circuit package process comprising:
- connecting an interconnect between an interconnect stack on a first integrated circuit device and a substrate, the first integrated circuit device on the substrate;
- applying a protective dot around the interconnect stack on the first integrated circuit device;
- mounting a second integrated circuit device, having an adhesive, out of contact with the interconnect stack and on the protective dot, with the adhesive on the first integrated circuit device;
- connecting the second integrated circuit device and the substrate;
- and
- encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.
A stacked integrated circuit package process comprising:
- connecting an interconnect between a ball stack on a first integrated circuit device having a peripheral bond pad and a substrate, the first integrated circuit device on the substrate;
- applying a protective dot to cover the interconnect and the ball stack on the peripheral bond pad;
- mounting a second integrated circuit device, having an adhesive, out of contact with the ball stack on the protective dot, with the adhesive on the first integrated circuit device;
- connecting the second integrated circuit device and the substrate;
- and encapsulating the first integrated circuit device, the second integrated circuit device, and the interconnect.
A stacked integrated circuit package system comprising:
- an interconnect between an interconnect stack on a first integrated circuit device and a substrate, the first integrated circuit device on the substrate;
- a protective dot around the interconnect stack on the first integrated circuit device;
- a second integrated circuit device, having an adhesive, mounted out of contact with the interconnect stack and on the protective dot, with the adhesive on the first integrated circuit device and the second integrated circuit device connected to the substrate;
- and
- an encapsulation to cover the first integrated circuit device, the second integrated circuit device, and the interconnect.
Dependencies are inferred from the claim text.