Method of forming a penetration electrode and substrate having a penetration electrode
AssigneeFujikura Ltd.
InventorsSatoshi Yamamoto, Takashi Takizawa
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Abstract
A method of forming a penetration electrode in which an electroconductive substance is inserted into a micropore that has one end blocked off only by wiring and a pad formed by an electroconductive substance without the wiring and pad being broken. In this method of forming a penetration electrode, an electroconductive substance is inserted into the micropore that penetrates a substrate and that has one aperture blocked off by an electroconductive thin film. After a protective member that holds the electroconductive thin film is provided on a surface on the electroconductive thin film side of the substrate, an electroconductive substance is inserted from the other aperture of the micropore.
Claims4
A substrate with a penetration electrode comprising:
- a substrate having a first surface and a second surface;
- a first insulating layer covering said first surface of said substrate;
- an electroconductive film formed on at least a portion of said first insulating layer on said penetration electrode;
- and
- a protective member bonded on at least a portion of said electroconductive film formed on said first insulating layer;
- wherein said penetration electrode comprises:
- a micropore penetrating through said substrate and said first insulating layer;
- a second insulating layer covering an inside surface of said micropore;
- and
- an electroconductive substance filling an inside of said second insulating layer of said micropore;
- wherein said electroconductive substance is in contact with said electroconductive film, and
- wherein said first insulating layer is contiguous with said second insulating layer.
Dependencies are inferred from the claim text.