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US 7,443,030 B2Granted
Thin silicon based substrate
AssigneeIntel Corporation
InventorsSriram Muthukumar, Devendra Natekar
Life of this patent
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Abstract
Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die.
Claims10
A device, comprising:
- a silicon layer with a first side and a second side opposite the first side;
- a plurality of conductive vias through the silicon layer from the first side to the second side;
- a first dielectric layer on the second side;
- a first conductive trace layer having conductive traces on the first dielectric layer, the conductive traces being electrically connected to the conductive vias;
- a second dielectric layer on the first conductive trace layer;
- a first plurality of conductive contacts, the first plurality of conductive contacts being electrically connected to the conductive traces;
- a second plurality of conductive contacts on the first side of the silicon layer, the second plurality of conductive contacts being electrically connected to the plurality of conductive vias.
4 more elements
A device, comprising:
- a silicon layer with a first side and a second side opposite the first side;
- a plurality of conductive vias through the silicon layer from the first side to the second side;
- a first dielectric layer on the second side;
- a first conductive trace layer having conductive traces on the first dielectric layer, the conductive traces being electrically connected to the conductive vias;
- a second dielectric layer on the first conductive trace layer;
- a first plurality of conductive contacts, the first plurality of conductive contacts being electrically connected to the conductive traces;
- a second plurality of conductive contacts on the first side of the silicon layer, wherein the first plurality of conductive contacts has a first pitch and the second plurality of conductive contacts has a second pitch smaller than the first pitch, and the first plurality of conductive contacts are electrically connected to the second plurality of conductive contacts;
- and
- a microelectronic die having a third plurality of conductive contacts with a third pitch approximately the same as the second pitch, the microelectronic die positioned adjacent the first side of the silicon layer and wherein the second plurality of conductive contacts are electrically connected to the third plurality of conductive contacts.
6 more elements
Dependencies are inferred from the claim text.