Electronic device having coalesced metal nanoparticles

An electronic device comprising:

• (a) a substrate;
• and
• (b) an electrically conductive layer consisting of coalesced metal nanoparticles and a residual amount of one or both of a stabilizer covalently bonded to the coalesced metal nanoparticles and a decomposed stabilizer covalently bonded to the coalesced metal nanoparticles as part of the electrically conductive layer wherein the coalesced metal nanoparticles consist of Au or Ag or Au-Ag or Au-Cu or Ag-Cu or Au-Ag-Cu or Au-Ag-Pd.
• wherein the stabilizer is an organic stabilizer, the residual amount of each of the stabilizer and the decomposed stabilizer or both combined is less than about 5% by weight of the electrically conductive layer, and wherein the decomposed stabilizer results from heating the stabilizer from about 50 to 250 degree C at an ambient pressure.