Integrated circuit package system including ribbon bond interconnect
AssigneesSTATS ChipPAC, Ltd., Orthodyne Electronics Corporation
InventorsYou Yang Ong, Kwang Yong Chung, Mohd Helmy Bin Ahmad, Garrett L. Wong, Christoph B. Luechinger
Life of this patent
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Abstract
An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.
Claims20
An integrated circuit package system including a ribbon bond interconnect, comprising:
- providing a semiconductor device having at least one pad thereon;
- providing an external connection;
- providing a heavy ribbon;
- and
- bonding the heavy ribbon to the external connection and to the pad on the semiconductor device, the bonding providing mesh-stitches on the heavy ribbon.
An integrated circuit package system including a ribbon bond interconnect, comprising:
- providing a semiconductor device having at least one pad thereon;
- providing an external pad;
- providing a heavy aluminum or aluminum-alloy ribbon;
- and bonding the heavy aluminum or aluminum-alloy ribbon to the external pad and to the pad on the semiconductor device, the bonding having criss-crossing mesh-stitches to bond the heavy aluminum or aluminum-alloy ribbon to the external pad and the at least one pad.
An integrated circuit package system including a ribbon bond interconnect, comprising:
- a semiconductor device having at least one pad thereon;
- an external connection;
- and
- a heavy ribbon bonded to the external connection and to the pad on the semiconductor device, the heavy ribbon bond having mesh-stitches to bond the heavy ribbon to the pad.
An integrated circuit package system including a ribbon bond interconnect, comprising:
- a semiconductor device having at least one pad thereon;
- an external pad;
- a heavy aluminum or aluminum-alloy ribbon bonded to the external pad and to the pad on the semiconductor device, the heavy ribbon bond having criss-crossing mesh-stitches to bond the heavy aluminum or alunimum-alloy ribbon to the external pad and the at least one pad.
Dependencies are inferred from the claim text.