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US 7,443,015 B2Granted
Integrated circuit package system with downset lead
AssigneeSTATS ChipPAC, Ltd.
InventorsJeffrey D. Punzalan, Sheila Marie L. Alvarez, Jose Alvin Caparas, Robinson Quiazon
Life of this patent
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Abstract
An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.
Claims13
An integrated circuit package system comprising:
- providing an integrated circuit package having a downset terminal lead;
- forming a planar recessed lead surface, a terminal external surface, and a terminal top wall of the downset terminal lead, the planar recessed lead surface on a side opposite the terminal external surface, the terminal external surface substantially planar to a plane of a package bottom surface, and the terminal top wall adjacent the planar recessed lead surface, for controlling connector collapse;
- attaching an integrated circuit over the planar recessed lead surface;
- and
- forming a die paddle having a half-etched region for bump collapse control.
2 more elements
An integrated circuit package system comprising:
- an integrated circuit package having a downset terminal lead;
- a planar recessed lead surface, a terminal external surface, and a terminal top wall of the downset terminal lead, the planar recessed lead surface on a side opposite the terminal external surface, the terminal external surface substantially planar to a plane of a package bottom surface, and the terminal top wall adjacent the planar recessed lead surface, for controlling connector collapse;
- an integrated circuit over the planar recessed lead surface;
- and a die paddle having a half-etched region for bump collapse control.
1 more element
Dependencies are inferred from the claim text.