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US 7,443,014 B2Granted
Electronic module and method of assembling the same
AssigneeInfineon Technologies AG
InventorRalf Otremba
Life of this patent
Estimating the term…
Abstract
An electronic module includes a semiconductor power switch and a semiconductor diode. The lower side of the semiconductor power switch includes an output contact mounted on a die pad of a leadframe, and the upper side of the semiconductor power switch includes a control contact and an input contact. The anode contact of the semiconductor diode is disposed on and electrically connected to the input contact of the semiconductor power switch. The cathode contact of the diode is electrically connected with the output contact of the power semiconductor switch.
Claims34
An electronic module, comprising:
- a leadframe comprising a die pad and a plurality of leads, each lead having an inner portion and an outer portion, wherein at least one lead extends from the die pad providing an output lead, the remaining leads being spaced at a distance from the die pad and providing at least one input lead and a control lead;
- a semiconductor power switch comprising an upper side and a lower side, wherein the lower side of the semiconductor power switch is mounted on the die pad, a control contact and an input contact are disposed on the upper side of the semiconductor power switch, and an output contact is disposed on the lower side of the semiconductor power switch;
- a semiconductor diode comprising an upper side and a lower side, wherein the upper side comprises a cathode contact and the lower side comprises an anode contact, wherein the anode contact is disposed on and electrically connected to the input contact of the semiconductor power switch, and wherein the cathode contact is electrically connected to the output contact of the power semiconductor switch;
- at least one first electrical conductor extending between and electrically connecting the control contact of the semiconductor power switch and the control lead of the leadframe;
- at least one second electrical conductor extending between and electrically connecting the input contact of the semiconductor power switch and the input lead of the leadframe;
- and
- an electrically insulating plastic material encapsulating at least the semiconductor diode, the semiconductor power switch, the first and second electrical conductors, and the inner portions of the leads.
4 more elements
An electronic module, comprising:
- a semiconductor power switch comprising an upper side and a lower side, wherein a control contact and an input source contact are disposed on the upper side of the semiconductor power switch, and wherein an output contact is disposed on the lower side of the semiconductor power switch;
- a semiconductor diode comprising an upper side and a lower side, wherein the upper side comprises a cathode contact and the lower side comprises an anode contact, wherein the anode contact is disposed on and electrically connected to the input contact of the semiconductor power switch;
- and
- an electrically insulating plastic material encapsulating the semiconductor diode and the semiconductor power switch;
- wherein the semiconductor diode is electrically connected in parallel with the semiconductor power switch, and wherein the electrically insulating plastic material provides a voltage of between about 500 V and 5000 V between the cathode contact of the semiconductor diode and the input contact of the semiconductor power switch.
2 more elements
An electronic module, comprising:
- a plurality of semiconductor power switches and semiconductor diodes arranged to provide a plurality of stacks, each stack including a semiconductor power switch and a semiconductor diode, wherein:
- the semiconductor power switch comprises an upper side and a lower side, a control contact and an input contact are disposed on the upper side of the semiconductor power switch, and an output contact is disposed on the lower side of the semiconductor power switch;
- the semiconductor diode comprises an upper side and a lower side, the upper side comprises a cathode contact and the lower side comprises an anode contact;
- in each stack, the anode contact of the semiconductor diode is disposed on and electrically connected to the input contact of the semiconductor power switch;
- and
- the plurality of semiconductor power switches and the plurality of semiconductor diodes are configured in an electronic circuit.
3 more elements
A method of assembling an electronic module, comprising:
- providing a leadframe comprising a die pad and a plurality of leads, each lead having an inner portion and an outer portion, wherein at least one lead extends from the die pad providing an output lead, the remaining leads being spaced at a distance from the die pad and providing at least one input lead and a control lead;
- providing at least one semiconductor power switch comprising an upper side and a lower side, wherein a control contact and an input contact are disposed on the upper side of the semiconductor power switch and an output contact is disposed on the lower side of the semiconductor power switch;
- attaching the lower side of the semiconductor power switch to the die pad;
- providing a semiconductor diode comprising an upper side and a lower side, wherein the upper side comprises a cathode contact and the lower side comprises an anode contact;
- mounting the diode on the semiconductor power switch by mounting and electrically connecting the anode contact to the input contact of the semiconductor power switch;
- electrically connecting the cathode contact of the semiconductor diode to the output lead;
- electrically connecting the control contact of the semiconductor power switch to the control lead of the leadframe;
- electrically connecting the input contact of the semiconductor power switch to the input lead;
- and
- encapsulating at least the semiconductor diode and the semiconductor power switch in electrically insulating plastic material.
7 more elements
A method of assembling an electronic module, comprising:
- providing at least one semiconductor power switch comprising an upper side and a lower side, wherein a control contact and an input contact are disposed on the upper side of the semiconductor power switch, and an output contact is disposed on the lower side of the semiconductor power switch;
- providing at least one semiconductor diode comprising an upper side and a lower side, wherein the upper side comprises a cathode contact and the lower side comprises an anode contact;
- mounting the semiconductor diode on the semiconductor power switch by mounting and electrically connecting the anode contact to the input contact of the semiconductor power switch;
- and
- providing electrical isolation between the cathode contact of the semiconductor diode and the input contact of the semiconductor power switch to provide a voltage of between 500 V and 5000 V between the cathode contact of the semiconductor diode and the input contact of the semiconductor power switch.
2 more elements
Dependencies are inferred from the claim text.