Semiconductor device

A semiconductor device, comprising:

• a conductive substrate having a chip mounting area and an external terminal area surrounding to the chip mounting area, wherein the conductive substrate in the external terminal area has an main surface, a back surface opposite to the main surface and a side surface located between the main and back surfaces, and wherein the conductive substrate comprises a plurality of conductive members;
• an insulating member, which is formed on the main surface of the conductive substrate in the chip mounting area;
• a semiconductor chip having a terminal, which is formed on the insulating member;
• a bonding wire extending the terminal and the main surface of the conductive members in the external terminal area;
• and
• a package body having an upper surface, a bottom surface and a package side surface being located between the upper and the bottom surfaces, wherein the package body covers all of the main and side surfaces of the conductive substrate, the semiconductor chip and the bonding wire, and wherein the back surface of the conductive substrate is exposed from the package body and is coplanar with the bottom surface of the package body, and
• wherein a width of the package body between the package side surface and the side surface of one of the conductive members at its main surface is getting wider gradually towards the bottom surface of the package body.