System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
AssigneeMarvell International Technology Ltd.
InventorsMichael David Cusack, Randall Don Briggs
Life of this patent
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Abstract
An integrated circuit or chip includes a first die and a second die positioned on a lead frame of a package including a lead frame, such as a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame. The integrated circuit further includes a redistribution layer formed on the first die to couple selected bond fingers of the lead frame to selected bonding pads of the first and second die. The selected bond fingers may correspond to bond fingers that receive a first supply voltage or the first supply voltage and a second supply voltage.
Claims21
An integrated circuit including a first and a second die positioned on a lead frame of a package, the integrated circuit device further including a redistribution layer formed on the first die to connect selected bond fingers of the lead frame to selected, remote, bonding pads of the first and second dies;
- wherein the redistribution layer comprises:
- a receiving segment positioned near an outer edge of the first die, the outer edge being adjacent bond fingers in the lead frame;
- a consolidation segment connected to the receiving segment;
- and a distribution segment positioned near an inner edge of the first die, the inner edge of the first die being positioned adjacent to an inner edge of the second die.
A computer system, comprising:
- at least one input device;
- at least one output device;
- at least one storage device;
- and
- computer circuitry coupled to the input, output, and storage devices, the computer circuitry including an integrated circuit device including a first and a second die positioned on a lead frame of a package, the integrated circuit device further including a redistribution layer formed on the first die to couple connect selected bond fingers of the lead frame to selected bonding pads of the first and second dies.
An integrated circuit including a first and a second die positioned on a lead frame of a package, the integrated circuit device further including a redistribution layer formed on the first die to connect selected bond fingers of the lead frame to selected bonding pads of the first and second dies,
- wherein the redistribution layer comprises a distribution segment positioned near an inner edge of the first die, the inner edge of the first die being positioned adjacent to an inner edge of the second die, the distribution segment substantially parallel to the inner edge of the first die.
An integrated circuit including a first and a second die positioned on a lead frame of a package, the integrated circuit device further including a redistribution layer formed on the first die to connect selected bond fingers of the lead frame to selected bonding pads of the first and second dies;
- and
- wherein at least one bonding pad of the second die is directly connected to the redistribution layer through a bonding wire.
An integrated circuit including a first and a second die positioned on a lead frame of a package, the integrated circuit device further including a redistribution layer formed on the first die to connect selected bond fingers of the lead frame to selected bonding pads of the first and second dies;
- wherein the redistribution layer is connected through a bonding wire to a bonding pad of the second die;
- wherein the bonding wire interconnecting the redistribution layer and the bonding pad of the second die has a first end connected to a corresponding bonding pad of the first die, with the bonding pad of the first die being connected directly to the redistribution layer;
- and
- wherein the bonding wire has a second end connected to the bonding pad of the second die.
Dependencies are inferred from the claim text.