Matrix form semiconductor package substrate having an electrode of serpentine shape

A matrix form semiconductor package substrate having an electrode situated in-between a plurality of integrated circuit (IC) package substrates for providing electrical communication to conductive pads situated on said plurality of IC package substrates comprising:

• said plurality of IC package substrates integrally formed on a substrate strip in a matrix form having a boundary between each two of said plurality of IC package substrates, each of said plurality of IC package substrates having a multiplicity of conductive pads;
• and
• said electrode formed in a rectangular-shaped, corrugated configuration along said boundary with each one of two legs of a corrugation connected to only one IC package substrate for providing electrical communication to said multiplicity of conductive pads and for providing insulation between said multiplicity of conductive pads after said plurality of IC package substrates are cut along said boundary through said electrode.