Method of forming thin film patterning substrate including formation of banks
AssigneeSeiko Epson Corporation
InventorsShunichi Seki, Hiroshi Kiguchi, Ichio Yudasaka, Hiroo Miyajima
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Abstract
Display devices such as EL elements or LED elements, are formed from thin film elements having banks of prescribed height and a thin film layer formed by an ink jet method in areas to be coated that are partitioned by those banks. The banks may be formed of an organic material on a bank formation surface configured of an inorganic material, plasma treatment is performed under conditions that the induction gas is fluorine-based and that fluorine is present excessively, and the areas enclosed by the banks subjected to surface treatment are filled with the liquid thin film material to form the thin film layer or layers.
Claims3
A thin film patterning substrate, used for forming thin films in patterns by a dip process or spin-coating process, comprising:
- a surface on which banks and areas to be coated are formed, the areas being partitioned by said banks;
- said banks being formed in two layers including a lower-layer inorganic substance and an upper-layer organic substance, and said areas to be coated being formed of an inorganic substance,
- a thin film arranged in at least one of said areas, the thin film being made from a thin film liquid.
Dependencies are inferred from the claim text.