High temperature imaging device
AssigneeHalliburton Energy Services, Inc.
InventorsRoger L. Schultz, James J. Freeman, Neal G. Skinner, Steven G. Streich
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Abstract
High temperature imaging devices are disclosed. In one embodiment, the imaging device comprises an array of photosensitive elements fabricated on an insulator substrate, and an information storage component coupled to the array. The information storage component stores data representing one or more light patterns detected by the array. The light patterns may be images or spectral patterns. The insulator substrate may be a sapphire or spinel substrate. Alternatively, the substrate may be silicon carbide or an insulated silicon substrate. In at least some embodiments, a processor is integrated on the same substrate as the array.
Claims29
An imaging device that comprises:
- an array of photosensitive elements fabricated on a spinel substrate;
- and
- an information storage component fabricated on the spinel substrate and coupled to the array to store digital data representing one or more light patterns detected by the array.
An imaging device that comprises:
- an array of photosensitive elements fabricated on a silicon carbide substrate;
- an information storage component coupled to the array to store data representing one or more light patterns detected by the array;
- and
- a processor coupled to the array and coupled to the information storage component,
- wherein the processor captures light patterns detected by the array and processes captured light patterns to generate said data representing one or more light patterns detected by the array, and
- wherein the processor is fabricated on a silicon carbide substrate.
An imaging device that comprises:
- an array of photosensitive elements fabricated on a silicon carbide substrate;
- an information storage component fabricated on the silicon carbide substrate and coupled to the array to store digital data representing one or more light patterns detected by the array;
- and
- a light aperture that forms an image on the array of photosensitive elements,
- wherein said one or more light patterns include the image formed by the light aperture on the array.
An imaging device that comprises:
- an array of photosensitive elements fabricated on a silicon carbide substrate;
- an information storage component fabricated on the silicon carbide substrate and coupled to the array to store digital data representing one or more light patterns detected by the array;
- and
- a diffraction grating that forms a spectral pattern on the array of photosensitive elements,
- wherein said one or more light patterns include the spectral pattern formed by the diffraction grating.
An imaging device that comprises:
- an array of photosensitive elements fabricated on a silicon carbide substrate;
- an information storage component coupled to the array to store data representing one or more light patterns detected by the array;
- and
- a prism that forms a spectral pattern on the array of photosensitive elements,
- wherein said one or more light patterns include the spectral pattern formed by the prism.
An imaging device that comprises:
- an array of photosensitive elements fabricated on an insulated silicon (SOI) substrate;
- an information storage component coupled to the array to store data representing one or more light patterns detected by the array;
- and
- a dispersive element that forms a spectral pattern on the array of photosensitive elements, wherein the dispersive element includes a prism, and
- wherein said one or more light patterns include the spectral pattern formed by the dispersive element.
A high temperature imaging method that comprises:
- placing an imaging device in a high temperature environment;
- receiving light through an aperture;
- and
- forming an image on a photosensitive array operable at temperatures greater than 200 C.
A high-temperature monitoring method that comprises:
- measuring a spectral composition of incident light with at least one photosensitive element fabricated on a spinel substrate;
- and
- processing a signal from the at least one photosensitive element to provide an indication of a material's presence.
Dependencies are inferred from the claim text.