Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

A circuitized substrate comprising:

• first and second organic dielectric layers each having a first surface thereon, said first surface of said first organic dielectric layer facing said first surface of said second organic dielectric layer;
• at least one electrical conductor positioned on each of said first surfaces of said first and second organic dielectric layers;
• a quantity of conductive paste interconnecting said at least one electrical conductor on said first surface of said first organic dielectric layer to said at least one electrical conductor on said first surface of said second organic dielectric layer, said quantity of conductive paste including a fluxless binder component and at least one metallic component including a plurality of microparticles, selected ones of said microparticles of said metallic component including a quantity of solder thereon;
• and
• a protective coating disposed over said solder for preventing oxidation thereof.

A method of making a circuitized substrate, said method comprising:

• providing at least one organic dielectric layer having first and second opposing surfaces;
• forming at least one opening within said at least one organic dielectric layer extending from said first opposing surface to said second opposing surface;
• positioning a quantity of conductive paste within said at least one opening, said quantity of conductive paste including a fluxless binder component and at least one metallic component including a plurality of microparticles, selected ones of said microparticles of said metallic component including a quantity of solder thereon;
• and
• disposing a protective coating over said solder for preventing oxidation thereof.

A method of making a circuitized substrate, said method comprising:

• providing first and second organic dielectric layers each having a first surface thereon;
• forming at least one electrical conductor on each of said first surfaces of said first and second organic dielectric layers;
• orienting said first and second dielectric layers such that said first surface of said first organic dielectric layer having at least one of said electrical conductors thereon faces said first surface of said second organic dielectric layer having at least one of said electrical conductors thereon;
• positioning a quantity of conductive paste between said first and second organic dielectric layers to interconnect said at least one electrical conductor on said first surface of said first organic dielectric layer to said at least one electrical conductor on said first surface of said second organic dielectric layer, said quantity of conductive paste including a fluxless binder component and at least one metallic component including a plurality of microparticles, selected ones of said microparticles of said metallic component including a quantity of solder thereon;
• and
• disposing a protective coating over said solder for preventing oxidation thereof.

A circuitized substrate comprising:

• at least one organic dielectric layer having first and second opposing surfaces;
• at least one opening within said at least one organic dielectric layer extending from said first opposing surface to said second opposing surface;
• and
• a quantity of conductive paste positioned within said at least one opening, said quantity of conductive paste including a binder component and a plurality of nano-wires, selected ones of said nano-wires including a quantity of solder thereon.

A circuitized substrate comprising:

• first and second organic dielectric layers each having a first surface thereon, said first surface of said first organic dielectric layer facing said first surface of said second organic dielectric layer;
• at least one electrical conductor positioned on each of said first surfaces of said first and second organic dielectric layers;
• and
• a quantity of conductive paste interconnecting said at least one electrical conductor on said first surface of said first organic dielectric layer to said at least one electrical conductor on said first surface of said second organic dielectric layer, said quantity of conductive paste including a binder component and a plurality of nano-wires, selected ones of said nano-wires including a quantity of solder thereon.