Low stress conductive polymer bump
AssigneeInternational Business Machines Corporation
InventorsWilliam E. Bernier, Marie S. Cole, Mukta G. Farooq, John U. Knickerbocker, Tasha E. Lopez, Roger A. Quon, David J. Welsh
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Abstract
Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
Claims16
A conductive interconnection for joining an integrated circuit device to a device carrier, said conductive interconnection comprising:
- a polymer having a spherical shape between said integrated circuit device and said device carrier;
- and
- patterned metal projections extending towards said polymer from at least one of said integrated circuit device and said device carrier,
- wherein said patterned metal projections each have a same height and extend partially into said polymer across the width of said polymer.
A conductive interconnection for joining an integrated circuit device to a device carrier, said conductive interconnection comprising:
- a polymer having a spherical shape between said integrated circuit device and said device carrier;
- metal particles encapsulated within said polymer;
- and
- dendrites comprising a plated coating on said metal particles.
A conductive interconnection for joining an integrated circuit device to a device carrier, said conductive interconnection comprising:
- a polymer having a spherical shape between said integrated circuit device and said device carrier;
- and
- patterned metal projections extending towards said polymer from said integrated circuit device and from said device carrier,
- wherein said patterned metal projections each have a same height and extend partially into said polymer across the width of said polymer, and
- wherein said patterned metal projections have a cone-shape and a triangular shape in cross-section.
Dependencies are inferred from the claim text.