Polymer for sealing porous materials during chip production
AssigneeInfineon Technologies AG
InventorsLudger Heiliger, Michael Schmidt, Georg Tempel
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Abstract
A compound and method for sealing or protecting porous materials used in semiconductor fabrication, and in particular for protecting the inner walls of trenches or recesses or vias which are present in such materials. Specifically, compounds and the method of use of the compounds in which polymer compounds comprising functional groups A and B are used to seal surface-exposed pores in porous materials used in chip production.
Claims24
A polymer compound having a polymer main chain and functional groups A and B, in which the functional group A can be bonded to silicon-containing materials and/or metal nitrides and has the following structure:
- (R2—O—)3-nSiR1n—R3,
- wherein n=1 or 2,
- R1 and R2 are in each case an alkyl or aryl group, it being possible for R1 and R2 to be identical or different, and
- R3 is an alkylene or arylene group;
- and the functional group B can be bonded to copper metal and/or tantalum, metal oxides, copper(I) oxide and/or copper(Il) oxide and has one or more of the following structures:
- wherein R1 and R3 are as defined in group A,
- and groups A and B are each linked to the polymer main chain via R3.
Dependencies are inferred from the claim text.