Integrated ball and via package and formation process
AssigneeKulicke and Soffa Industries, Inc.
InventorsDavid T. Beatson, Jamin Ling
Life of this patent
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Abstract
A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.
Claims11
A method of processing a semiconductor device, the method comprising the steps of:
- providing a semiconductor device supported by a carrier structure, the carrier structure defining a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure;
- extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface, wherein the plurality of vias defined by the carrier structure are pre-defined prior to the extending step;
- forming a free air ball at the first end of the conductor after the step of extending;
- drawing the free air ball at least partially in contact with the second surface;
- and
- electrically coupling another portion of the conductor to a portion of the semiconductor device.
Dependencies are inferred from the claim text.