Decoupling capacitor for high frequency noise immunity
AssigneeMicron Technology, Inc.
InventorArup Bhattacharyya
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AssigneeMicron Technology, Inc.
InventorArup Bhattacharyya
Estimating the term…
Systems and methods are provided for an on-chip decoupling device and method. One aspect of the present subject matter is a capacitor. One embodiment of the capacitor includes a substrate, a high K dielectric layer doped with nano crystals disposed on the substrate, and a top plate layer disposed on the high K dielectric layer. According to one embodiment, the high K dielectric layer includes Al2O3. According to other embodiments, the nano crystals include gold nano crystals and gold nano crystals. One capacitor embodiment includes a MIS (metal-insulator-silicon) capacitor fabricated on silicon substrate, and another capacitor embodiment includes a MIM (metal-insulator-metal) capacitor fabricated between the interconnect layers above silicon substrate. The structure of the capacitor is useful for reducing a resonance impedance and a resonance frequency for an integrated circuit chip. Other aspects are provided herein.
A method of forming a Metal-Insulator-Metal (MIM) decoupling capacitor for a circuit having a resonance impedance at an interconnect level on top of silicon, comprising:
A method of forming a Metal-Insulator-Metal (MIM) decoupling capacitor, comprising:
A method of forming a Metal-Insulator-Metal (MIM) capacitor for a circuit having a resonance impedance, comprising:
A method of forming a Metal-Insulator-Metal (MIM) capacitor, comprising:
A method of forming a Metal-Insulator-Metal (MIM) capacitor, comprising:
A method of forming a Metal-Insulator-Metal (MIM) capacitor, comprising:
A method of forming a Metal-Insulator-Metal (MIM) capacitor, comprising:
Dependencies are inferred from the claim text.