Method for producing a chip-substrate connection
AssigneeInfineon Technologies AG
InventorsHans-Jörg Reichert, Margarete Deckers, Rainer Zanner
Life of this patent
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Abstract
A method and an apparatus for producing a chip-substrate connection by alloying or brazing, using a solder containing two or more components with at least two metal-containing constituents X and Y. The first constituent X contains in particular gold or a similar precious metal, and the second constituent Y being consumed in the soldering operation by reacting or being dissolved in the materials or layers which are to be joined. The solder has a hypereutectic concentration of the second constituent Y. The invention furthermore relates to a solder for the production of a chip-substrate connection, and to a semiconductor component with a semiconductor chip which is secured to a substrate by alloying or brazing.
Claims18
A method for producing a chip-substrate connection, which comprises:
- performing one of alloying and brazing a chip to a substrate using a solder containing at least two components with at least two metal-containing constituents including a first constituent X containing a precious metal and a second constituent Y being consumed in a soldering operation by one of reacting and being dissolved by materials being joined, and the solder having a hypereutectic concentration of the second constituent Y.
A method for producing a chip-substrate connection, which comprises:
- providing a substrate;
- providing a chip having incorporated therein a doping layer or a contact implantation and a rear side and an adhesive or diffusion barrier containing Ti/Pt and being provided on the rear side;
- performing one of alloying and brazing the chip to the substrate by depositing a solder at the rear side of the chip directly on the adhesive or diffusion barrier to form a chip-substrate connection by the solder, the solder containing at least two components with at least two metal-containing constituents including a first constituent X containing a precious metal and a second constituent Y being consumed in a soldering operation by one of reacting and being dissolved by materials being joined, and the solder having a hypereutectic concentration of the second constituent Y.
A method for producing a chip-substrate connection, which comprises:
- providing a substrate;
- providing a chip having incorporated therein a doping layer or a contact implantation and a rear side and an adhesive or diffusion barrier containing Ti/Pt and being provided on the rear side;
- performing one of alloying and brazing the chip to the substrate by depositing a solder at the rear side of the chip directly on the adhesive or diffusion barrier to form a chip-substrate connection by the solder, the solder containing at least two components with at least two metal-containing constituents including a first constituent X containing a precious metal and a second constituent Y being consumed in a soldering operation by one of reacting and being dissolved by materials being joined, and the solder having a hypereutectic concentration of the second constituent Y, the solder containing a gold-tin compound (AuSn) having a composition by weight of Au to Sn of initially 70 to 30 and forming a layer having a thickness of from about 1 μm to about 2 μm, Sn contained in the solder diffusing away from the solder into adjoining layers, loss of Sn providing a continuous reduction in a melting temperature during a soldering procedure, resulting in a metallic layer bonded to the semiconductor chip and the substrate, said metallic layer containing Sn.
Dependencies are inferred from the claim text.