Manufacturing method of a package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsGwo-Liang Weng, Cheng-Yin Lee
Life of this patent
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Abstract
A manufacturing method of a package structure is provided. Firstly, a substrate having a surface is provided. Next, a chip is disposed on the surface of the substrate. Then, a packing material layer is formed on the surface of the substrate. Next, a this film is pasted on the packing material layer. Then the substrate and the packing material layer are thoroughly cut along a cutting line around the chip by a first cutting blade but the thin film is not cut thoroughly. Next, the substrate is thoroughly cut along at least a part of the cutting line by a second cutting blade but the packing material layer is not thoroughly cut such that a part of the packing material layer is exposed. The width of the second cutting blade is larger than the width of the first cutting blade.
Claims8
A manufacturing method of a package structure, the method comprising:
- providing a substrate having a surface;
- disposing a chip on the surface of the substrate;
- forming a packing material layer on the surface of the substrate;
- pasting a thin film on a surface of the packing material layer;
- cutting thoroughly the substrate and the packing material layer along a cutting line around the chip by a first cutting blade without cutting thoroughly the thin film;
- and
- cutting thoroughly the substrate along at least a part of the cutting line by a second cutting blade without cutting thoroughly the packing material layer for exposing a part of the packing material layer, wherein the width of the second cutting blade is larger than the width of the first cutting blade.
Dependencies are inferred from the claim text.