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AssigneeMicron Technology, Inc.
InventorsTongbi Jiang, Curtis Hollingshead, Warren M. Farnworth
Estimating the term…
Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of disposing underfill including electrically charged filler elements on microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic component, a plurality of electrical couplers carried by the microelectronic component, and an underfill layer covering at least a portion of the electrical couplers. The underfill layer comprises a binder and a plurality of electrically charged filler elements in the binder. The underfill layer can include a first zone having a first concentration of electrically charged filler elements and a second zone having a second concentration of electrically charged filler elements different than the first concentration.
A method for disposing a flowable material on a microelectronic device having a pad and an electrical coupler, the method comprising flowing the flowable material including a plurality of electrically charged elements onto the microelectronic device, wherein the flowable material covers at least a portion of the electrical coupler.
A method for disposing a flowable material on a microelectronic device assembly including a microelectronic component, a substrate, and an electrical coupler coupling the microelectronic component to the substrate, the method comprising:
A method of attaching a substrate to a microelectronic component device including a microelectronic component and an electrical coupler coupled to the microelectronic component, the method comprising:
Dependencies are inferred from the claim text.