Dispensed electrical interconnections

A method of forming a packaged electronic device, comprising:

• dispensing a nonconductive adhesive material on a substrate having thereon an electrical element;
• at least partially curing the nonconductive adhesive material;
• dispensing a conductive adhesive material on the electrical element and on the at least partially cured nonconductive material;
• at least partially curing the conductive adhesive material;
• and
• providing a second electrical element on the substrate;
• wherein dispensing the conductive adhesive material comprises dispensing the conductive adhesive material on the second electrical element;
• and
• wherein the conductive adhesive material provides an electrical connection between the electrical element and the second electrical element.

A method of forming a packaged electronic device, comprising:

• dispensing a nonconductive adhesive material on a substrate having thereon an electrical element;
• at least partially curing the nonconductive adhesive material;
• dispensing a conductive adhesive material on the electrical element and on the at least partially cured nonconductive material;
• at least partially curing the conductive adhesive material;
• and
• providing a second substrate adjacent the first substrate, the second substrate having thereon a second electrical element;
• wherein dispensing the nonconductive adhesive material comprises dispensing the nonconductive adhesive material on an interface between the first substrate and the second substrate;
• wherein dispensing the conductive adhesive material comprises dispensing the conductive adhesive material on the second electrical element;
• and
• wherein the conductive adhesive material provides an electrical connection between the electrical element and the second electrical element.

A method of forming a packaged electronic device, comprising:

• forming a bond pad on a substrate;
• forming an electrical trace on the substrate, the electrical trace being electrically coupled to the bond pad;
• forming a nonconductive adhesive material on the electrical trace;
• at least partially curing the nonconductive adhesive material;
• dispensing a conductive adhesive material at least partially on the nonconductive adhesive material;
• positioning a conductive reflector cup on the conductive adhesive material, the reflector cup defining an optical cavity above the bond pad;
• and curing the conductive adhesive material.