Method for manufacturing anisotropic conductive sheet
AssigneesMicro Precision Co. & Ltd., Okins Electronics Co., Ltd
InventorNorihiro Asada
Life of this patent
Estimating the term…
Abstract
In order to provide an anisotropic conductive sheet which can be applied to more finely and more narrowly pitched electrodes and also to provide spring electrodes applied for the anisotropic conductive sheet, the spring electrodes manufactured as follows. A part having a bending leaf spring shape is formed out of a monocrystal silicon by anisotropic etching and gold is plated on the surface of the part so as to obtain a silicon spring electrode 1. The silicon spring electrodes 1 are inserted in through holes formed on a silicone rubber sheet and fixed to the through holes.
Claims1
A method for manufacturing an anisotropic conductive sheet comprising:
- step A;
- etching through a monocrystal silicon wafer by a deep reactive ion etching so as to form a part having a bending leaf spring shape such that planes of said formed leaf spring are parallel to a cross section of said wafer,
- step B;
- forming a silicon spring electrode by forming a conductive layer on a surface of said part having the bending leaf spring shape formed in step A, and
- step C;
- inserting a plurality of said silicon spring electrodes formed in step B respectively into through holes of a soft plastic sheet such that said spring electrodes are clamped and fixed to said soft plastic sheet and do not extend out of the holes during operation.
Dependencies are inferred from the claim text.