Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging

A method of testing and analyzing a semiconductor packaging material containing a molding compound for stability of the semiconductor packaging material in a sustained oxygen environment, said method comprising the steps of:

• providing N substantially identical samples such that N is a positive integer of at least 2, wherein each of the N samples comprises the semiconductor packaging material, wherein the semiconductor packaging material comprised by the N samples comprises one or more cured raw materials containing the molding compound, wherein T samples of the N samples are test samples, wherein C samples of the N samples are control samples, and wherein T and C are positive integers such that T+C=N;
• exposing during a time period τ the T test samples to a pressurized gas having a total pressure PTOT(t), said pressurized gas comprising oxygen gas, wherein for times t during 0≦t≦τ the oxygen gas has a partial pressure P(t) of at least P1 and a temperature T(t) satisfying TG−ΔT2≦T(t)≦TG−ΔT1 such that 0<ΔT1≦ΔT2 for glass transition temperature TG of the molding compound, wherein during 0≦t≦τ the T test samples are exposed to moisture having a relative humidity H(t) such that H1≦H(t)≦H2, wherein H1≧0% and H2≦100%, wherein τ is at least about 12 hours, wherein P1 is about 15 psi, and wherein TG−ΔT2 is at least about 20° C.;
• exposing the C control samples during times t for a time period τ′ to a pressurized inert gas having a pressure P′(t) and a temperature of T′(t) at a relative humidity H′(t), wherein a common time interval exists for times t during which both the pressurized gas comprising oxygen and the pressurized inert gas are being exposed by the respective exposing steps, wherein during said common time interval:
• P′(t)≧P(t) or P′(t) does not substantially differ from P(t), T′(t)≧(T(t) or T′(t) does not substantially differ from T(t), and H′(t)≧H(t) or H′(t) does not substantially differ from H(t);
• wherein after said exposing the T test samples and the C control samples, the method further comprises:
• measuring at least one characteristic common to the C control samples and the T test samples;
• ascertaining that there exists at least one significant difference between the at least one measured characteristic of the T test samples and the at least one characteristic of the C control samples;
• and
• responsive to said ascertaining, designating the semiconductor packaging material as being unstable and performing further testing, analysis, or testing and analysis of the semiconductor packaging material.