Adhesive composition and thermal transfer sheet
AssigneeDai Nippon Printing Co., Ltd.
InventorsHideki Usuki, Naohiro Obonai
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AssigneeDai Nippon Printing Co., Ltd.
InventorsHideki Usuki, Naohiro Obonai
Estimating the term…
The present invention provides an adhesive composition comprising a copolymer (a) of a methylmethacrylate (MMA) and/or a butylmethacrylate (BMA) and a styrene (St), also provides an adhesive composition comprising a mixture of an acrylic polymer (b) and a ketone resin, wherein the acrylic polymer (b) is at least one polymer selected from the group consisting of a poly MMA, a poly BMA, a MMA/BMA copolymer or a MMA/BMA/St copolymer, and also provides a thermal transfer sheet having a layer comprising the adhesive composition. The adhesive composition has excellent heat sealing characteristics and resistance to blocking when it is used for the formation of an adhesive layer, is also superior in miscibility with various organic or inorganic additives and allows these additives to exhibit their functions sufficiently when these additives are added and has high transparency.
A thermal transfer sheet comprising a transfer layer disposed in a peelable manner on at least a part of one surface of a substrate sheet, wherein the transfer layer contains a layer consisting of the adhesive composition which comprises a copolymer (a) of a methylacrylate and/or a butylmethacrylate and a styrene at a position of an outermost layer, and wherein the copolymer has a ratio by weight of acrylic monomer including a methylmethacrylate and a butylmethacrylate to a styrene monomer (acrylic monomer:
A thermal transfer sheet comprising a transfer layer disposed in a peelable manner on at least a part of one surface of a substrate sheet, wherein the transfer layer contains a layer consisting of the adhesive composition which comprises a mixture of an acrylic polymer (b) and a ketone resin at a position of an outermost layer, wherein the acrylic polymer is at least one copolymer selected from the group consisting of methylmethacrylate/butylmethacrylate copolymer and methylmethacrylate/butylmethacrylate/styrene copolymer, wherein the ratio by weight of the acrylic resin to the ketone resin is 25 to 30:1 to 5, Tg of the acrylic polymer is 40° C. to 100° C., the weight average molecular weight of the acrylic polymer is 20,000 to 150,000, and the layer consisting of the adhesive composition is heat-sensitive.
Dependencies are inferred from the claim text.