Chemical mechanical polishing pad

A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the polishing face and a side face for interconnecting said polishing and non-polishing faces and including a pattern of first recessed portions which are formed on the non-polishing face, are open to the non-polishing face and are located exclusive of the side face, and which further comprises a circular or polygonal recessed portion, which does not form the pattern, in a center portion of said non-polishing face wherein a double-coated adhesive tape is affixed to said non-polishing face thereby to form closed spaces of said first recess portions between said double-coated adhesive tape and said non-polishing face and wherein said first recessed portions do not extend to said polishing face.