Polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting

A method of monitoring a chemical mechanical polishing (CMP) process in situ, comprising:

• providing a chemical mechanical polishing (CMP) pad on a platen, the chemical mechanical polishing (CMP) pad including a polishing layer having a recessed region, thereby forming a pseudo window area adjacent to the recessed region, the pseudo window area being composed of the same material as the polishing layer and having a thickness less than a thickness of the polishing layer and a thickness greater than zero;
• and
• monitoring light passed through the pseudo window area to control the chemical mechanical polishing (CMP) process;
• wherein
• the platen includes a hole in which a platen window made of a transparent material is arranged, the hole being vertically aligned with the pseudo window area.

A method of monitoring a chemical mechanical polishing (CMP) process in situ, comprising:

• providing a chemical mechanical polishing (CMP) pad on a platen, the chemical mechanical polishing (CMP) pad including a polishing layer a pseudo, window area, and a transparent supporting layer, the pseudo window area being composed of the same material as the polishing layer;
• and
• monitoring light passed through the pseudo window area to control the chemical mechanical polishing (CMP) process;
• wherein
• the platen includes a hole in which a platen window made of a transparent material is arranged, the hole being vertically aligned with the pseudo window area, and
• the transparent supporting layer is arranged between the pseudo window area and the platen window such that the light also passes through the transparent supporting layer.

A method of monitoring a chemical mechanical polishing (CMP) process in situ, comprising:

• providing a chemical mechanical polishing (CMP) pad on a platen, the chemical mechanical polishing (CMP) pad including a polishing layer and a pseudo window area and the platen including a platen layer and a platen window, the platen window being composed of transparent material and protruding higher than a height of the platen layer;
• and
• monitoring light passed through the pseudo window area to control the chemical mechanical polishing (CMP) process;
• wherein
• the pseudo window area is composed of the same material as the polishing layer, and
• the platen layer includes a hole in which the platen window is arranged to provide a recessed region between the pseudo window area and the platen window, the hole being vertically aligned with the pseudo window area.

A method of detecting an end point in situ, comprising:

• providing a pad on a platen, the pad including a polishing layer and a pseudo window area, the pseudo window area being composed of the same material as the polishing layer, and having a thickness less than a thickness of the polishing layer and a thickness greater than zero;
• and
• monitoring light passed through the pseudo window area to detect the end point;
• wherein
• the platen includes a hole in which a platen window made of a transparent material is arranged to provide a recessed region between the pseudo window area and the platen window, the hole being vertically aligned with the pseudo window area.

A method of detecting an end point in situ, comprising:

• providing a pad on a platen, the pad including a polishing layer having a recessed region, thereby forming a pseudo window area adjacent to the recessed region, the pseudo window area being composed of the same material as the polishing layer, and having a thickness less than a thickness of the polishing layer and a thickness greater than zero;
• and
• monitoring light passed through the pseudo window area to detect the end point;
• wherein
• the platen includes a hole in which a platen window composed of a transparent material is arranged, the hole being vertically aligned with the pseudo window area.

A method of detecting an end point in situ, comprising:

• providing a pad on a platen, the pad including a polishing layer and a pseudo window area, the pseudo window area being composed of the same material as the polishing layer;
• and
• monitoring light passed through the pseudo window area to detect the end point;
• wherein
• the platen includes a hole in which a platen window made of a transparent material is arranged, the hole being vertically aligned with the pseudo window area, and
• the pad further includes a transparent supporting layer arranged between the platen window and the pseudo window area.

A method of detecting an end point in situ, comprising:

• providing a pad on a platen, the pad including a polishing layer and a pseudo window area, the pseudo window area being composed of the same material as the polishing layer, the platen including a platen layer and a platen window, the platen window being composed of a transparent material, and protruding higher than a height of the platen layer;
• and
• monitoring light passed through the pseudo window area to detect the end point;
• wherein
• the platen includes a hole in which the platen window is arranged, the hole being vertically aligned with the pseudo window area.