Electrical connecting device and method of forming same
AssigneeInternational Business Machines Corporation
InventorsGareth Geoffrey Hougham, Brian Samuel Beaman, Claudius Feger
Life of this patent
Estimating the term…
Abstract
Techniques for providing electrical connections are provided. In one aspect, an electrical connecting device is provided which comprises a plurality of compressible contacts; and a downstop structure surrounding at least a portion of one or more of the contacts, limiting compression of the contacts, and being configured to limit interaction between the contacts. The electrical connecting device may be further configured to have the plurality of compressible contacts have a first coefficient of thermal expansion and the downstop structure have a second coefficient of thermal expansion, the first coefficient of thermal expansion being substantially similar to the second coefficient of thermal expansion.
Claims16
An electrical connecting device comprising:
- a plurality of compressible contacts;
- and
- a downstop structure surrounding at least a portion of one or more of the contacts, limiting compression of the contacts, and being configured to limit interaction between the contacts, whet cm said plurality of compressible contacts have a first coefficient of thermal expansion and said downstop structure has a second coefficient of Thermal expansion, the first coefficient of thermal expansion being substantially similar to the second coefficient of thermal expansion so that thermally induced dimensional changes of said downstop structure substantially match thermally induced dimensional changes of said plurality of compressible contacts.
A method of fabricating an electrical connecting device, the method comprising the steps of:
- forming a downstop structure surrounding at least a portion of one or more of a plurality of compressible contacts;
- configuring the downstop structure to limit compression of the contacts;
- and
- configuring the downstop structure to limit interaction between the contacts, wherein said plurality of compressible contacts have a first coefficient of thermal expansion and said downstop structure has a second coefficient of thermal expansion, the first coefficient of thermal expansion being substantially similar to the second coefficient of thermal expansion so that thermally induced dimensional changes of said downstop structure substantially match thermally induced dimensional changes of said plurality of compressible contacts.
Dependencies are inferred from the claim text.