Reflow Furnace
AssigneeTamura Furukawa Machinery Corporation
InventorsMotomu Shibamura, Atsushi Tanaka
Life of this patent
Estimating the term…
Abstract
In the first buffering area provided between the inlet of the furnace and the heating chamber, the ambient gas is blown to the printed circuit board from the lower side of the carrier device, while the ambient gas is sucked in the upper side of the carrier device, thus the outside air is prevented from infiltrating and the ambient gas is prevented from flowing out. Furthermore, the flux is prevented from being attached to the printed circuit board, by installing the flux dropping prevention mechanism in the suction port of the ambient gas.
Claims12
A reflow furnace comprising:
- a plurality of heating chambers to heat by blowing a heated ambient gas to a printed circuit boards carried within the furnace by a carrier device;
- a cooling chamber provided next to said heating chamber to cool said printed circuit boards;
- a first buffering area provided between said heating chamber and an inlet of the reflow furnace;
- a blowing device to blow the ambient gas from a lower side of the carrier device to an upper side thereof in said first buffering area;
- a suction device with a flux dropping-prevention mechanism to suck the ambient gas above the carrier device in said first buffering area;
- and
- a flux collection unit to remove the flux from the sucked ambient gas.
A reflow furnace comprising:
- a plurality of heating chambers to heat by blowing a heated ambient gas to a printed circuit boards carried within the furnace by a carrier device;
- a cooling chamber provided next to said heating chamber to cool said printed circuit boards;
- a buffering area provided between said cooling chamber and an outlet of the reflow furnace;
- a blowing device to blow the ambient gas from a lower side of the carrier device to an upper side thereof in said buffering area;
- a suction device with a flux dropping-prevention mechanism to suck the ambient gas above the carrier device in said buffering area;
- and
- a flux collection unit to remove the flux from the sucked ambient gas.
A reflow furnace comprising:
- a plurality of heating chambers to heat by blowing a heated ambient gas to a printed circuit boards carried within the furnace by a carrier device;
- a cooling chamber provided next to said heating chamber to cool said printed circuit boards;
- a buffering area provided between said heating chamber and said cooling chamber;
- a blowing device to blow the ambient gas from a lower side of the carrier device to an upper side thereof in said buffering area;
- a suction device with a flux dropping-prevention mechanism to suck the ambient gas above the carrier device in said buffering area;
- and
- a flux collection unit to remove the flux from the sucked ambient gas.
Dependencies are inferred from the claim text.