Fan frame and heat dissipation fan incorporating the fan frame
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsChin-Wen Yeh, Chin-Long Ku, Zhi-Jian Peng
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AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsChin-Wen Yeh, Chin-Long Ku, Zhi-Jian Peng
Estimating the term…
A heat dissipation fan includes a fan frame, a stator mounted to the frame, and a rotor rotatably disposed around the stator. The fan frame includes a bracket, a central tube for positioning the stator, and a supporting member. The supporting member is made of a material having a higher bending strength than a plastic material used to form the bracket and the central tube. The supporting member includes a main body connected to the central tube, a plurality of ribs extending radially outwardly from the main body, and a plurality of engaging units formed at free ends of the ribs, respectively. The engaging units are embedded in the bracket for integrally connecting the central tube to the bracket.
A fan frame comprising:
A heat dissipation fan comprising:
A fan frame for a heat dissipation fan, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Axial-flow pumps: axial flow fans
The electric motor being specially adapted for integration in the pump: the electric motor being of the inside-out type, i.e. the rotor is…
Selection of particular materials: especially adapted for elastic fluid pumps
Cooling ; Heating; Diminishing heat transfer: specially adapted for elastic fluid pumps
Term ended 3 Aug 2026 (estimated)
The present invention relates generally to heat dissipation fans, and more particularly to a new and improved fan frame for use in connection with a heat dissipation fan typically intended for dissipating heat from electronic components.
As technology continues to advance, it is inevitable that electronic components such as integrated circuits (ICs) will incorporate even larger numbers of transistors and other such components in their construction, and accordingly, these ICs will have an even higher level of heat emission. Thus it can be seen that, achieving a high enough level of heat dissipation problem in electronic components has become an obstacle affecting their further development and has to be addressed.
In order to reduce the high temperature resulting from operations of the electronic components, heat dissipation fans are commonly used. Conventional heat dissipation fans generally comprise a fan frame, a stator mounted in a middle portion of the fan frame and a rotor rotatable with respect to the stator.
Many aspects of the present heat dissipation fan can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present heat dissipation fan. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
FIG. 1 is an exploded, isometric view of a heat dissipation fan in accordance with a preferred embodiment of the present invention;
FIG. 2 is an assembled, isometric view of the heat dissipation fan of FIG. 1;
Referring to FIGS. 1-2, a heat dissipation fan 10 in accordance with a preferred embodiment of the present invention comprises a fan frame 12, a stator 14 mounted to the fan frame 12 and a rotor 16 rotatably disposed around the stator 14.
Referring to FIG. 3, the fan frame 12 is comprises a rectangular bracket 121, a central tube 122 located in the bracket 121 and a supporting member 123 interconnecting the bracket 121 with the central tube 122. The bracket 121 is molded from a plastic material, and includes an air inlet 121b (see FIG. 1) and an air outlet 121a. The air inlet 121b and the air outlet 121a are located at opposite sides of the bracket 121, wherein the air outlet 121a is located adjacent to the central tube 122. The central tube 122 is a hollow tubular unit and is also molded from a plastic material. The central tube 122 is located at middle portion of the bracket 121, extending from the air outlet 121a toward the air inlet 121b. The stator 14 is mounted around the central tube 122, while the rotor 16 is mounted to the central tube 122 via a bearing system 15. The bearing system 15 is received in the central tube 122 and the rotor 16 has a shaft (not visible) rotatably supported in the bearing system 15. Thus the rotor 16 is rotatable in the bracket 121 when the fan 10 operates. The rotor 16 has a plurality of blades 161 extending radially outwardly from an outer periphery of a hub (not labeled) thereof. A printed circuit broad (PCB) 18 is located at a bottom portion of the stator 14. The PCB 18 is electrically connected to a power supply (not shown) through a group of electrical wires 19. The electrical wires 19 provide electric power to drive the rotor 16 to rotate at high speeds. The bearing system 15 can be a self-lubricating bearing system, for supporting rotation of the rotor 16 therein. During high speed rotation of the rotor 16, the blades 161 cooperatively generate an airflow flowing from the air inlet 121b towards the air outlet 121a; thus, heat generated by heat-generating electronic components can be dissipated by the airflow.
Referring also to FIG. 4, the supporting member 123, which connects the bracket 121 with the central tube 122, is used for securing the central tube 122 in place. The supporting member 123 is made of a metallic material having a higher mechanical bending strength than the plastic material of which the bracket 121 or the central tube 122 is made. An electrical insulating layer (not labeled) covers an outer surface of the supporting member 123 so as to render the supporting member 123 thermally conductive but electrically insulated. The electrical insulating layer may be a layer of insulating material coated on the outer surface of the supporting member 123. The metallic material used to form the supporting member 123 can be copper alloy, aluminum alloy, ferroalloy or any other suitable metallic materials having a relatively high mechanical strength. Thus, though the supporting member 123 is not electrically conductive, it is heat conductive.