Connector

A connector comprising:

• a housing;
• a module assembly disposed inside the housing, including
• an electric connector unit to be connected to a counterpart device,
• a semiconductor element,
• a light receiving element,
• a light emitting element,
• a positioning plate in which a positioning hole is formed, and on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed,
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning pin and a projection on a bottom face of the three-dimensional optical oath component on which a lens section is formed, and
• a printed circuit board on which the electric connecter unit, the semiconductor element, and the positioning plate are mounted;
• and
• an optical fiber cable extending from a rear side of the housing, wherein:
• the three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole formed in the positioning plate and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate,
• an alignment mark is formed on the positioning plate,
• the positioning hole is positioned with reference to the alignment mark, and
• the light receiving element and the light emitting element are positioned with reference to the alignment mark.

A connector, comprising:

• a housing;
• a module assembly disposed inside the housing, including:
• an electric connector unit to be connected to a counterpart device,
• a semiconductor element,
• a light receiving element,
• a light emitting element,
• a positioning plate in which a positioning hole is formed and on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed,
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning pin and a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed, and
• a printed circuit board on which the electric connecter unit, the semiconductor element, and the positioning plate are mounted;
• and
• an optical fiber cable extending from a rear side of the housing, wherein:
• the three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole formed in the positioning plate and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate,
• the positioning plate includes a frame having a rectangular shape, a bridge extending across the frame, and a window defined by the frame and the bridge, and
• the semiconductor element is arranged within the window.

A connector, comprising:

• a housing;
• a module assembly disposed inside the housing, including
• an electric connector unit to be connected to a counterpart device,
• a semiconductor element,
• a light receiving element,
• a light emitting element,
• a positioning plate in which a positioning hole is formed, and on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed,
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning pin and a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed, and
• a printed circuit board on which the electric connecter unit, the semiconductor element, and the positioning plate are mounted;
• and
• an optical fiber cable extending from a rear side of the housing, wherein:
• the three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole formed in the positioning plate and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate, wherein:
• the optical fiber cable includes an optical fiber core, and a cladding surrounding the optical fiber core;
• an optical connector is connected to an end of the optical fiber cable and to the three-dimensional optical path component inside the housing;
• a lock structure is disposed in the vicinity of the optical connector and fitted in a recess formed inside the housing, the lock structure including a first caulking member including a center hole through which the optical fiber cable extends and an annular section surrounding the center hole, and a second caulking member to be loosely fitted on the annular section of the first caulking member;
• and
• the cladding of the optical fiber cable extending out of the center hole of the first caulking member is divided longitudinally into a plurality of divided pieces and radially opened such that ends of the radially opened divided pieces are interposed and held between the annular section of the first caulking and the second caulking member.

A mount structure comprising:

• a semiconductor element;
• a light receiving element;
• a light emitting element;
• a positioning plate in which a positioning hole is formed, and on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed;
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning pin and a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed, the projection being spaced apart from the lens section;
• and
• a printed circuit board on which the semiconductor element and the positioning plate are mounted, wherein:
• the three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate.

A mount structure, comprising:

• a semiconductor element;
• a light receiving element;
• a light emitting element;
• a positioning plate in which a positioning hole is formed and on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed;
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning pin and a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed;
• and
• a printed circuit board on which the semiconductor element and the positioning plate are mounted, wherein:
• the three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate,
• an alignment mark is formed on the positioning plate,
• the positioning hole is positioned with reference to the alignment mark, and
• the light receiving element and the light emitting element are positioned with reference to the alignment mark.

A mount structure, comprising:

• a semiconductor element;
• a light receiving element;
• a light emitting element;
• a positioning plate in which a positioning hole is formed and on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed;
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning pin and a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed;
• and
• a printed circuit board on which the semiconductor element and the positioning plate are mounted, wherein:
• the three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate,
• the positioning plate includes a frame having a rectangular shape, a bridge extending across the frame, on which bridge the light emitting element mount section and the light emitting element mount section are formed, and a window defined by the frame and the bridge, and
• the semiconductor element is arranged within the window.

A connector comprising:

• a housing;
• a module assembly disposed inside the housing, including
• an electric connector unit to be connected to a counterpart device,
• a semiconductor element,
• a light receiving element,
• a light emitting element,
• a positioning plate in which a positioning hole is formed, and on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed,
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning pin and a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed, and
• a printed circuit board on which the electric connecter unit, the semiconductor element, and the positioning plate are mounted;
• and
• an optical fiber cable extending from a rear side of the housing, wherein:
• the three-dimensional optical path component is positioned such that the positioning pin of the three-dimensional optical path component is fitted in the positioning hole formed in the positioning plate and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate, and
• the positioning pin of the three-dimensional optical path component is a metal positioning boss member fixed by insert molding.

A connector comprising:

• a housing;
• a module assembly disposed inside the housing, including
• an electric connector unit to be connected to a counterpart device,
• a semiconductor element,
• a light receiving element,
• a light emitting element,
• a positioning plate on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed, including a positioning boss member made of metal and fixed by insert molding,
• a three-dimensional optical path component mounted on the positioning plate, including an optical path, and a positioning hole and a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed, and
• a printed circuit board on which the electric connecter unit, the semiconductor element, and the positioning plate are mounted;
• and
• an optical fiber cable extending from a rear side of the housing;
• wherein the three-dimensional optical path component is positioned such that the positioning boss member of the positioning plate is fitted in the positioning hole of the three-dimensional optical path component and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate.

A connector comprising:

• a housing;
• a module assembly disposed inside the housing, including
• an electric connector unit to be connected to a counterpart device,
• a semiconductor element,
• a light receiving element,
• a light emitting element,
• a positioning plate on an upper face of which a light receiving element mount section and a light emitting element mount section where the light receiving element and the light emitting element are mounted, respectively, are formed, including an alignment mark,
• a three-dimensional optical path component that is a transparent synthetic resin molded product and is mounted on the positioning plate, including an optical path, a projection on a bottom face of the three-dimensional optical path component on which a lens section is formed, and a hole alignment mark including a hole formed during molding, and
• a printed circuit board on which the electric connecter unit, the semiconductor element, and the positioning plate are mounted;
• and
• an optical fiber cable extending from a rear side of the housing;
• wherein the three-dimensional optical path component is positioned such that the hole alignment mark of the three-dimensional optical path component is placed over the alignment mark of the positioning plate and the projection of the three-dimensional optical path component abuts the upper face of the positioning plate.