Performance testing apparatus for heat pipes
AssigneeFoxconn Technology Co., Ltd.
InventorsTay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Chi Lee
Life of this patent
Estimating the term…
Loading patent…
AssigneeFoxconn Technology Co., Ltd.
InventorsTay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Chi Lee
Estimating the term…
A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion to detect the temperature of the evaporating section of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
A performance testing apparatus for a heat pipe comprising:
Dependencies are inferred from the claim text.