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US 7,441,926 B2Granted
Light emitting diode package
AssigneeEverlight Electronics Co., Ltd.
InventorsChien-Chang Pei, Shih-Jen Chuang
Life of this patent
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Abstract
A light emitting diode package is disclosed. It includes a chip, a slug, a PCB, a lens and a reflector. The chip is mounted on the slug. The slug transmits the heat of the chip out of the light emitting diode package. The PCB connects the chip with circuits or wires. The lens transmits the emitting light of the chip out of the light emitting diode package. The reflector reflects the emitting light of the chip, and combines the slug, the PCB and the lens together.
Claims20
A light emitting diode package, comprising:
- a printed circuit board, comprising two opposite surfaces, a relatively big through hole and a plurality of relatively small through holes disposed around the relatively big through hole, one of the two opposite surfaces including an indentation within which all the through holes are located;
- multiple pairs of solderable circuits, extending from one of the two opposite surfaces to the other one of the opposite surfaces through edges of the printed circuit board;
- a heat sink, comprising a first portion fitted within the relatively big through hole and a second portion fitted within the indentation, wherein the first portion comprises a chip-mounting area for mounting at least one LED chip;
- a lens, placed over the chip-mounting area;
- and
- a reflector having a first part immediately encircling the lens and a second part securing the second portion of the heat sink to the printed circuit board, wherein the first part and the second part interconnect with each other through the relatively small through holes.
3 more elements
Dependencies are inferred from the claim text.