Light source module
AssigneeAu Optronics Corporation
InventorsShen-Hong Chou, Pang-Hsuan Liu
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AssigneeAu Optronics Corporation
InventorsShen-Hong Chou, Pang-Hsuan Liu
Estimating the term…
A method for assembling light emitting diode units and a substrate in a light source module and a structure thereof are provided. The light emitting diode unit is made of a light emitting diode and a carrier. Every light emitting diode has a flanged profile in the bottom to form a leaned plane, and a corresponding hole is formed on the substrate. Hence, when the light emitting diodes are pressed on the surface of a radiator by the substrate to make a closer contact, the light emitting diodes will be able to bear the pressure by the flanged design.
A light source module, comprising:
A light source module, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Structurally associated with non-printed electric components: associated with components mounted in printed circuit boards [PCB], e.g.…
Light sources using semiconductor devices as light-generating elements
Characterised by passive heat-dissipating elements, e.g. heat-sinks: with fins or blades
With essentially identical parallel planar fins or blades, e.g. with comb-like cross-section: the planes containing the fins or blades having the…
Term ended 30 Apr 2026 (estimated)
The present invention generally relates to a light source module, and more particularly relates to a method and structure for assembling light emitting diode units and a substrate in a light source module.
In the light source module of the prior art, the method and structure for assembling light emitting diode units and a substrate and the step of attaching the assembly structure on a radiator are provided in FIG. 1A to FIG. 1C. Now referring to FIG. 1A, a cross-sectional view of the light source module comprising a plurality of light emitting diode units 12 and a substrate 11 to carry the light emitting diode units 12 is shown. The substrate 11 has a first surface 111 (in the bottom) and a second surface 112 (in the top) corresponding to each other. A plurality of through holes 113 are formed to pass through the substrate 11. The patterned conductive circuit 114 is formed in the first surface 111 of the substrate 11.
Still referring to FIG. 1A, each light emitting diode unit 12 comprises a light emitting diode 121 and a carrier 122. A plurality of leads 124 are electrically connected to the light emitting diode 121 and extend out from the sidewalls of the carrier 122.
The accompany drawings incorporated in and forming a part of the specification illustrate several aspects of the present invention, and together with the description serve to explain the principles of the invention. In the drawings:
FIGS. 1A-1C show the conventional steps of assembling light emitting diode units to the substrate and a radiator;
FIGS. 2A-2C show the steps of the preferred embodiment of the present invention for assembling light emitting diode units to a substrate and a radiator;
The following is the detailed description of the present invention, which describes the light source module of the invention, but the detailed structure and the operating theory are not discussed. The portions relating to the conventional techniques are briefly described, and the parts of the drawings are not proportionally drafted. While embodiments are discussed, it is not intended to limit the scope of the present invention. Except expressly restricting the amount of the components, it is appreciated that the quantity of the disclosed components may be greater than that of disclosed.
One of the preferred embodiments of the present invention provides an assembling method and structure of a light source module including light emitting diode units and a substrate and the assembly structure can closely attached on a radiator. Now referring to FIG. 2A, a cross-sectional view is shown. The light source module comprises a plurality of light emitting diode units and a substrate used to carry the light emitting diode units. In the present embodiment, the substrate 21 comprises a printed circuit board or any other multi-layer board. The substrate 21 has a first surface 211 (on the bottom) and a second surface 212 (on the top) corresponding to each. other. And a plurality of through holes are formed in the substrate 21 and are corresponding to the position of the light emitting diode units. Beside, a patterned conductive circuit 214 which is formed by a copper layer or other conductive layer is exposed on the first surface 211 of the substrate 21.
Still referring to FIG. 2A, the light emitting diode unit 22 comprises a light emitting diode 221 and a carrier 222. Wherein the diameter of the light emitting diode 221 is smaller than the diameter of the first through hole 213. However, the bottom of the carrier 222 extends to form a fixed portion, which has a larger diameter than the diameter of the first through hole 213. A plurality of leads 224 electrically connecting to the light emitting diode 221 extend from two sides of fixed portion 223.