Method of aligning components for installation on a head suspension assembly
AssigneeHutchinson Technology Incorporated
InventorRaymond R. Wolter
Life of this patent
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Abstract
A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.
Claims5
A method of aligning components for installation on a head suspension assembly for supporting a head slider over a storage media in a dynamic storage device, the head suspension assembly having a spring metal layer, an electrically conductive layer, and a dielectric layer interposed between the metal layer and the electrically conductive layer, and a plurality of electrically conductive traces terminating in bond pads in the electrically conductive layer, the method comprising the steps of:
- forming an alignment structure in the electrically an alignment structure, the datum feature having a first edge parallel to an edge of the bond pads;
- and
- exposing the electrically conductive layer to an etchant so that the bond pad edge migrates during the etching process toward the alignment structure first edge and the alignment structure first edge migrates during the etching process away from the bond pad edge at an equal etching rate.
Dependencies are inferred from the claim text.