# US 7,420,268 B2 · Semiconductor chip package and application device thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,420,268 B2 - Document ID: US7420268B2 - Status: Granted - Kind: B2 - Application number: 11/264,903 - Filed: 2005-11-01 - Published: 2007-03-01 - Granted: 2008-09-02 - Earliest claimed: 2005-08-30 - Assignees: Quarton, Inc. - Inventors: Tony K. T. Chen - Web page: https://patentgrep.com/patent/US7420268B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - F21K 9/00: Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers - F21K 9/233: specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps - F21Y 2107/30: on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section - F21Y 2115/10: Light-emitting diodes [LED] - H10W 90/00: Package configurations - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A semiconductor chip package has a pillar body including at least three conductors insulated from each other by an insulating layer. The pillar body has a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer. A plurality of semiconductor chips are attached on the mounting faces and selectively and electrically connected to the conductors. The semiconductor package of the present invention can be used in a semiconductor illuminator which has a housing having a reflecting cup, with the pillar body positioned inside the reflecting cup. ## Claims ### Claim 1 A semiconductor chip package, comprising: a pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each conductor defining a portion of two adjacent mounting faces, and with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer; and a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors. ### Claim 2 (depends on 1) The package of claim 1, wherein the mounting faces are evenly disposed around the periphery of the pillar body. ### Claim 3 (depends on 1) The package of claim 1, wherein the two conductors on each mounting face have different first and second surface areas, with the first surface area being larger than the second surface area. ### Claim 4 A semiconductor chip package, comprising: a pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer; and a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors; wherein the insulating layer is positioned off-center on each mounting face. ### Claim 5 (depends on 3) The package of claim 3, wherein the semiconductor chips of a mounting face are attached on the conductor which has the first surface area. ### Claim 6 (depends on 1) The package of claim 1, wherein the semiconductor chips are electrically connected to the conductors by bonding wires. ### Claim 7 (depends on 1) The package of claim 1, wherein the semiconductor chips are flip chips. ### Claim 8 A semiconductor chip package, comprising: a pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer; and a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors; wherein the semiconductor chips are LED chips. ### Claim 9 (depends on 1) The package of claim 1, wherein the two conductors on each mounting face have the same surface areas. ### Claim 10 (depends on 1) The package of claim 1, wherein the insulating layer is positioned at the center on each mounting face. ### Claim 11 A semiconductor illuminator, comprising: a housing having a reflecting cup; a pillar body positioned inside the reflecting cup, the pillar body including at least three conductors insulated from each other by an insulating layer, the pillar body having a periphery that includes a plurality of mounting faces, with each mounting face defined by two adjacent conductors separated by a portion of the insulating layer; and a plurality of semiconductor chips attached on each of the mounting faces and selectively and electrically connected to the conductors. ### Claim 12 (depends on 11) The illuminator of claim 11, wherein the mounting faces are evenly disposed around the periphery of the pillar body. ### Claim 13 (depends on 11) The illuminator of claim 11, wherein the two conductors on each mounting face have different first and second surface areas, with the first surface area being larger than the second surface area. ### Claim 14 (depends on 11) The illuminator of claim 11, wherein the insulating layer is positioned off-center on each mounting face. ### Claim 15 (depends on 13) The illuminator of claim 13, wherein the semiconductor chips of a mounting face are attached on the conductor which has the first surface area. ### Claim 16 (depends on 11) The illuminator of claim 11, wherein the semiconductor chips are electrically connected to the conductors by bonding wires. ### Claim 17 (depends on 11) The illuminator of claim 11, wherein the semiconductor chips are flip chips. ### Claim 18 (depends on 11) The illuminator of claim 11, wherein the semiconductor chips are LED chips. ### Claim 19 (depends on 11) The illuminator of claim 11, wherein the two conductors on each mounting face have the same surface areas. ### Claim 20 (depends on 11) The illuminator of claim 11, wherein the insulating layer is positioned at the center of each mounting face. ### Claim 21 (depends on 11) The illuminator of claim 11, wherein each conductor defines a portion of two adjacent mounting faces.