Determining layer thickness using photoelectron spectroscopy
AssigneeReVera Incorporated
InventorBruno Schueler
Life of this patent
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AssigneeReVera Incorporated
InventorBruno Schueler
Estimating the term…
According to one embodiment of the invention, photoelectron spectroscopy is used to determine the thickness of one or more layers in a single or multi-layer structure on a substrate. The thickness may be determined by measuring the intensities of two photoelectron species or other atom-specific characteristic electron species emitted by the structure when bombarded with photons. A predictive intensity function that is dependent on the thickness of a layer is determined for each photoelectron species. A ratio of two predictive intensity functions is formulated, and the ratio is iterated to determine the thickness of a layer of the structure. According to one embodiment, two photoelectron species may be measured from a single layer to determine a thickness of that layer. According to another embodiment, two photoelectron species from different layers or from a substrate may be measured to determine a thickness of a layer.
A method for determining a thickness of a layer using electron spectroscopy comprising:
A method for determining a thickness of a layer in a multi-layer structure comprising:
A method for determining a thickness of a layer in a multi-layer structure comprising:
A method for determining a thickness of a layer in a multi-layer structure comprising:
A machine readable medium having stored thereon executable program code which, when executed, causes a machine to perform a method for determining a thickness of a layer using electron spectroscopy, the method comprising:
Dependencies are inferred from the claim text.