Microelectronic cleaning compositions containing oxidizers and organic solvents
AssigneeMallinckrodt Baker, Inc.
InventorChien-Pin Sherman Hsu
Life of this patent
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Abstract
Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k dielectrics and copper or aluminum metallizations contain an oxidizing agent and a polar organic solvent selected from amides, sulfones, sulfolenes, selenones and saturated alcohols, and optionally other components.
Claims9
A cleaning composition capable of cleaning photoresist and residues from microelectronic substrates, said cleaning composition consisting essentially of:
- from about 0.1 to about 30% by weight of hydrogen peroxide as an oxidizing agent;
- from about 10 to about 99% by weight of sulfolane as a polar organic solvent having hydrogen bonding capability and minimally or non-reactive with the oxidizing agent;
- from more than 0 to about 30% by weight of an tetramethylammonium hydroxide as an alkaline base;
- 0.1 to 5% by weight of trans-1,2-cyclohexanediamine tetraacetic acid as a chelating or metal complexing agent;
- and
- from about 0.1 to about 98% by weight water.
A cleaning composition capable of cleaning photoresist and residues from microelectronic substrates, said cleaning composition consisting essentially of:
- from about 0.1 to about 30% by weight of hydrogen peroxide as anoxidizing agent;
- from about 10 to about 99% by weight of sulfolane as a polar organic solvent having hydrogen bonding capability and minimally or non-reactive with the oxidizing agent;
- from more than 0 to about 30% by weight of an tetramethylammonium hydroxide as an alkaline base;
- 0.1 to 5% by weight of ethylenediamine tetra(methylene phosphonic acid) as a chelating or metal complexing agent;
- and
- from about 0.1 to about 98% by weight water.
A cleaning composition capable of cleaning photoresist and residues from microelectronic substrates, said cleaning composition consisting of:
- from about 0.1 to about 30% by weight of hydrogen peroxide as an oxidizing agent;
- from about 1 to about 90% by weight of sulfolane as a polar organic solvent having hydrogen bonding capability and minimally or non-reactive with the oxidizing agent;
- from more than 0 to about 30% by weight of tetramethylammonium hydroxide as an Alkaline base;
- 0.1 to 5% by weight of trans-1,2-cyclohexanediamine tetraacetic acid as a chelating or metal complexing agent;
- and
- from about 0.1 to about 98% by weight water.
Dependencies are inferred from the claim text.