# US 7,411,794 B2 · Carrier unit for a semiconductor device and semiconductor socket using the same

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- Number: US 7,411,794 B2
- Document ID: US7411794B2
- Status: Granted
- Kind: B2
- Application number: 11/387,797
- Filed: 2006-03-24
- Published: 2006-10-19
- Granted: 2008-08-12
- Earliest claimed: 2005-03-25
- Assignees: Yamaichi Electronics Co., Ltd.
- Inventors: Yoshinori Wakabayashi; Minoru Hisaishi; Takeyuki Suzuki; Noriyuki Matsuoka
- Web page: https://patentgrep.com/patent/US7411794B2

## CPC

- G01R 1/0483: {Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.

## Claims

### Claim 1

A carrier unit for a semiconductor device comprising:
an electrode sheet having a bump-forming surface on which are formed bumps to be electrically connected to terminals of a semiconductor device;
a posture-stabilizing member disposed on said bump-forming surface of said electrode sheet, having an opening through which pass the terminals of said semiconductor device and said bumps, said member for stabilizing a posture of a connecting surface of said semiconductor device, on which the terminals of said semiconductor device are formed, to be generally parallel to said bump-forming surface of said electrode sheet; and
a housing member having an accommodating portion for accommodating said electrode sheet and said posture-stabilizing member.

### Claim 2 (depends on 1)

A carrier unit for a semiconductor device as claimed in claim 1, further comprising a pressing body for pressing the terminals of said semiconductor device onto said bumps on said electrode sheet at a predetermined pressure via the opening of said posture-stabilizing member.

### Claim 3 (depends on 1)

A carrier unit for a semiconductor device as claimed in claim 1, wherein said electrode sheet and said posture-stabilizing member are formed in integral with each other.

### Claim 4 (depends on 1)

A carrier unit for a semiconductor device as claimed in claim 1, wherein an elastic sheet is provided in the accommodating portion of said housing member at a position beneath said electrode sheet and said posture-stabilizing member.

### Claim 5 (depends on 4)

A carrier unit for a semiconductor device as claimed in claim 4, wherein said elastic sheet is provided in a part of a bottom wall of the accommodating portion in said housing member.

### Claim 6 (depends on 1)

A socket for a semiconductor device comprising:
a carrier unit for a semiconductor device as claimed in claim 1;
a socket body having an accommodation portion for accommodating said carrier unit for a semiconductor device; and
a contact terminal provided in said socket body, for being connected to an electrode pad of an electrode sheet in said carrier unit for a semiconductor device.

### Claim 7 (depends on 2)

A socket for a semiconductor device comprising:
a carrier unit for a semiconductor device as claimed in claim 2;
a socket body having an accommodation portion for accommodating said carrier unit for a semiconductor device; and
a contact terminal provided in said socket body, for being connected to an electrode pad of an electrode sheet in said carrier unit for a semiconductor device.

### Claim 8 (depends on 3)

A socket for a semiconductor device comprising:
a carrier unit for a semiconductor device as claimed in claim 3;
a socket body having an accommodation portion for accommodating said carrier unit for a semiconductor device; and
a contact terminal provided in said socket body, for being connected to an electrode pad of an electrode sheet in said carrier unit for a semiconductor device.

### Claim 9 (depends on 4)

A socket for a semiconductor device comprising:
a carrier unit for a semiconductor device as claimed in claim 4;
a socket body having an accommodation portion for accommodating said carrier unit for a semiconductor device; and
a contact terminal provided in said socket body, for being connected to an electrode pad of an electrode sheet in said carrier unit for a semiconductor device.