# US 7,411,384 B2 · Wafer chuck > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,411,384 B2 - Document ID: US7411384B2 - Status: Granted - Kind: B2 - Application number: 11/682,703 - Filed: 2007-03-06 - Published: 2007-07-05 - Granted: 2008-08-12 - Earliest claimed: 2004-09-06 - Assignees: Tokyo Electron Limited - Inventors: Ikuo Ogasawara; Yoshiyasu Kato - Web page: https://patentgrep.com/patent/US7411384B2 ## CPC - H10P 72/7612: {characterised by lifting arrangements, e.g. lift pins} - G01R 31/2886: {Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06)} - G01R 31/2893: {Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00)} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A wafer chuck is provided with a plurality of pins which protrude and retreat in a plurality of through holes formed in a vertical direction on a mounting table, and an ascending/descending mechanism for ascending and descending the pins. The wafer chuck receives a wafer by protruding the pins from the mounting plane of the mounting table. On each upper end surface of the pin, a receiving surface part is provided for substantially not making a gap between the pin and each of the corresponding through holes and a mechanism for aligning the receiving surface part with the mounting surface is provided. ## Claims ### Claim 1 A wafer chuck comprising: a plurality of pins, each of which protrudes and retreats via a through hole formed in a vertical direction in a mounting table, each of the pins including at a top end thereof a receiving surface part which virtually makes no gap between each of the pins and the through hole; a joint member for supporting the pins; an ascending/descending mechanism for ascending and descending the joint member to thereby protrude and retreat the pins, the wafer chuck being configured to receive or deliver a wafer by protruding the pins above a mounting surface of the mounting table; and a mechanism for aligning the receiving surface part of each of the pins to be flush with the mounting surface, wherein the mechanism includes a supported surface part formed below the receiving surface part of each of the pins, a supporting part formed in the through hole to be contacted with the supported surface part, and a pressing arrangement for making the supported surface part constantly contact the supporting part, and wherein the pressing arrangement includes a first pressing mechanism for biasing the joint member, and a second pressing mechanism provided at each of the pins for biasing each of the pins. ### Claim 2 (depends on 1) The wafer chuck of claim 1, wherein the supporting part is formed of a stepped portion having a hole with a smaller diameter than that of an adjacent portion of the through hole, the stepped portion being provided to accommodate therein the receiving surface part of each of the pins. ### Claim 3 (depends on 1) The wafer chuck of claim 1, wherein a part of each of the pins between the receiving surface part and the supported surface part has an upside-down truncated cone shape. ### Claim 4 (depends on 1) The wafer chuck of claim 1, wherein each of the pins has a stopper ring fixed to an axis thereof, and the second pressing mechanism is adapted to press the stopper ring downwards. ### Claim 5 (depends on 1) The wafer chuck of claim 1, wherein the second pressing mechanism is formed of a coil spring elastically provided in the through hole. ### Claim 6 A wafer chuck comprising: a plurality of pins, each of which protrudes and retreats via a through hole formed in a vertical direction in a mounting table, each of the pins including at a top end thereof a receiving surface part which virtually makes no gap between each of the pins and the through hole; a joint member for supporting the pins; an ascending/descending mechanism for ascending and descending the joint member to thereby protrude and retreat the pins; a mechanism for aligning the receiving surface part to be flush with the mounting surface, wherein the mechanism includes a supported surface part formed below the receiving surface part of each of the pins, a supporting part formed in the through hole to be contacted with the supported surface part, and a pressing arrangement for making the supported surface part constantly contact the supporting part; and a number of cylinder mechanisms provided around the mounting table, each cylinder mechanism including a vertically moving receiving part, and the wafer chuck being configured to deliver and receive a wafer supported by a dicing frame by protruding the receiving part above the mounting surface of the mounting table, and wherein the pressing arrangement includes a first pressing mechanism for biasing the joint member, and a second pressing mechanism formed at each of the pins for biasing each of the pins. ### Claim 7 (depends on 6) The wafer chuck of claim 6, wherein the supporting part is formed of a stepped portion having a hole with a smaller diameter than that of an adjacent portion of the through hole, the stepped portion being provided to accommodate therein the receiving surface part of each of the pins. ### Claim 8 (depends on 6) The wafer chuck of claim 6, wherein a part of each of the pins between the receiving surface part and the supported surface part has an upside-down truncated cone shape. ### Claim 9 (depends on 6) The wafer chuck of claim 6, wherein each of the pins has a stopper ring fixed to an axis thereof, and the second pressing mechanism is adapted to press the stopper ring downwards. ### Claim 10 (depends on 6) The wafer chuck of claim 6, wherein the second pressing mechanism is formed of a coil spring elastically provided in the through hole.