# US 7,411,295 B2 · Circuit board, device mounting structure, device mounting method, and electronic apparatus

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- Number: US 7,411,295 B2
- Document ID: US7411295B2
- Status: Granted
- Kind: B2
- Application number: 10/948,231
- Filed: 2004-09-24
- Published: 2005-10-13
- Granted: 2008-08-12
- Earliest claimed: 2004-04-02
- Assignees: Fujitsu Limited
- Inventors: Mitsuo Suehiro
- Web page: https://patentgrep.com/patent/US7411295B2

## CPC

- H10W 72/071: {Connecting or disconnecting}
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H10W 72/00: Interconnections or connectors in packages
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/3494: Heating processes for reflow soldering
- H05K 2201/09236: Parallel layout
- H05K 2201/09736: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/10734: Ball grid array [BGA]; Bump grid array
- H05K 2203/0195: Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
- H10W 72/0711: {Apparatus therefor}
- H10W 72/072: {of bump connectors}
- H10W 72/07227: {involving guiding structures, e.g. spacers or supporting members}
- H10W 72/07231: {Techniques}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/285: {Alignment aids, e.g. alignment marks}
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS

## Abstract

A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.

## Claims

### Claim 1

A circuit board having a mounting area to be mounted with an electronic component that has plural solder bumps that are two-dimensionally arranged, said circuit board comprising:
plural metal strip-shaped patterns, each of which extends in parallel in a first direction, exposes on a surface of said circuit board, and crosses from an inside to an outside of the mounting area, part of each metal pattern located in the mounting area being electrically connectable to plural corresponding solder bumps,
wherein at least one outermost patterns among the plural metal patterns has a part that is located outside the mounting area, and bends in a second direction orthogonal to the first direction to form two side surfaces used for an alignment between the electronic component and the mounting area in the first and second directions in mounting the electronic component on the mounting area of the circuit board.

### Claim 2 (depends on 1)

The circuit board according to claim 1, wherein the at least one of the pair of outermost patterns has a U shape.

### Claim 3 (depends on 1)

The circuit board according to claim 1, wherein the plural metal patterns are formed on both front and back surfaces of said circuit board.

### Claim 4 (depends on 1)

The circuit board according to claim 1, wherein each metal pattern has a part that is located outside the mounting area, and serves as a heating terminal used to melt the plural corresponding solder bumps on the mounting area through heat conduction, and as an inspection terminal used to inspect an electric connection condition between the plural corresponding solder bumps and the metal pattern.

### Claim 5 (depends on 1)

An electronic apparatus comprising:
a circuit board according to claim 1; and
an electronic component mounted on the circuit board.