# US 7,411,293 B2 · Flash memory card > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,411,293 B2 - Document ID: US7411293B2 - Status: Granted - Kind: B2 - Application number: 11/452,805 - Filed: 2006-06-14 - Published: 2007-03-29 - Granted: 2008-08-12 - Earliest claimed: 2005-09-27 - Assignees: Kingston Technology Corporation - Inventors: Ben Wei Chen; David Hong-Dien Chen; Jason Jajen Chen - Web page: https://patentgrep.com/patent/US7411293B2 ## CPC - H10W 90/00: Package configurations - H10W 70/611: {for connecting multiple chips together} - H10W 70/699: {for flat cards, e.g. credit cards} - H10W 70/63: Vias, e.g. via plugs - H10W 70/655: Fan-out layouts - H10W 70/688: {Flexible insulating substrates} - H10W 72/01: {Manufacture or treatment} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 90/22: the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL - H10W 90/231: {the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure} - H10W 90/24: at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape - H10W 90/732: {between stacked chips} - H10W 90/752: {between stacked chips} - H10W 90/753: {between laterally-adjacent chips} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield. ## Claims ### Claim 1 A Flash memory card comprising a substrate; a Flash memory die on top of the substrate, the substrate including a first plurality of bonding pads; a controller die on top of the Flash memory die, the controller die including a third plurality of pads; and a interposer coupled to the controller die and on top of the Flash memory die, the interposer includes a fourth plurality of bonding pads, that are located in proximity to the first, second and third of plurality of bonding pads to allow for wire connections therebetween, wherein the fourth plurality of bonding pads of the interposer allows for wire bonding to be shifted to the interposer and allows wiring bonding to the substrate to be minimized. ### Claim 2 (depends on 1) The Flash memory card of claim 1 wherein the interposer surrounds the controller die. ### Claim 3 (depends on 1) The Flash memory card of claim 1 wherein the interposer is placed side by side with the controller die. ### Claim 4 (depends on 1) The Flash memory card of claim 1 wherein the interposer is on top of the controller. ### Claim 5 (depends on 2) The Flash memory card of claim 2 which includes a second Flash memory die coupled to the interposer and a spacer for separating the Flash memory die from the second Flash memory die. ### Claim 6 (depends on 1) The Flash memory card of claim 1 wherein the interposer includes at least one connecting trace. ### Claim 7 (depends on 2) The Flash memory card of claim 2 wherein the interposer includes a cut out in a middle area large enough to accommodate the Flash controller die. ### Claim 8 (depends on 1) The Flash memory card of claim 1 wherein the interposer comprises a serpentine flexible memory on die member. ### Claim 9 (depends on 1) The Flash memory card of claim 1 wherein the interposer comprises an extended tab and a supporting stand off underneath the extended tab, wherein the extended tab hangs over the edge of the dies, and the wire bonding is used to connect from extended tab portion of the interposer to a second interposer on an upper level. ### Claim 10 (depends on 2) The Flash memory card of claim 2 wherein a height of the Flash controller die is minimized based upon the interposer surrounding the Flash controller die. ### Claim 11 (depends on 4) The memory card of claim 4 wherein the height of the spacer is a function of a wire distance between the bond pad of the interposer and bond pads of the memory die. ### Claim 12 A Flash memory card comprising: a substrate, the substrate including a first plurality of bonding pads; a first Flash memory die on top of the substrate, the first flash memory die including a second plurality of bonding pads that are located in proximity to the first, second and third of plurality of bonding pads; a Flash controller die on top of the first Flash memory die, the flash controller die including a third plurality of pads; an extended tab interposer coupled on top of the first Flash memory die, the extended tab interposer including a fourth plurality of bonding pads that are located in proximity to the first, second and third of plurality of bonding pads to allow for wire connections there between, wherein the extended tab interposer allows for wire bonding to connect to the interposer on the upper level; and second Flash memory die; wherein the second Flash memory die is coupled to the extended tab interposer; and a spacer for separating the first Flash memory die from the second Flash memory die. ### Claim 13 (depends on 12) The Flash memory card of claim 12 wherein the extended tab interposer includes a plurality of bonding pads for at least one connecting wire bonding to the interposer on the upper level. ### Claim 14 (depends on 12) The Flash memory card of claim 12 wherein the extended tab interposer includes a cut out in a middle area large enough to accommodate the first and second Flash controller dies.