# US 7,411,292 B2 · Flash memory card > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,411,292 B2 - Document ID: US7411292B2 - Status: Granted - Kind: B2 - Application number: 11/237,283 - Filed: 2005-09-27 - Published: 2007-03-29 - Granted: 2008-08-12 - Earliest claimed: 2005-09-27 - Assignees: Kingston Technology Corporation - Inventors: Ben Wei Chen; Wei Koh; David Hong-Dien Chen - Web page: https://patentgrep.com/patent/US7411292B2 ## CPC - H10W 90/00: Package configurations - H10W 70/611: {for connecting multiple chips together} - H10W 70/699: {for flat cards, e.g. credit cards} - H10W 70/63: Vias, e.g. via plugs - H10W 70/655: Fan-out layouts - H10W 72/01: {Manufacture or treatment} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/60: Strap connectors, e.g. thick copper clips for grounding of power devices - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 90/231: {the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure} - H10W 90/732: {between stacked chips} - H10W 90/752: {between stacked chips} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A memory card comprising a substrate, a memory die on top of the memory die, a controller die on top of the memory die; and a interposer surrounding the controller die and on top of the memory die wherein the interposer allows for wire bonding to the substrate to be minimized. A system and method in accordance with the present invention achieves the following objectives: (1) increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies when stacking is necessary, to increase density of the Flash card; (3) has only a few necessary signal I/O bonding wires to the substrate to improve production yield. ## Claims ### Claim 1 A memory card comprising: a substrate, the substrate including a first plurality of bonding pads; a memory die on top of the substrate, the memory die including a second plurality of bonding pads that are located in proximity to the first plurality of bonding pads; a controller die on top of the memory die, the controller die including a third plurality of bonding pads; and a interposer coupled to the controller die and on top of the memory die, the interposer includes a fourth plurality of bonding pads, that are located in proximity to the first, second and third of plurality of bonding pads to allow for wire connections therebetween, wherein the fourth plurality of bonding pads of the interposer allows for wire bonding to be shifted to the interposer and allows wiring bonding to the substrate to be minimized. ### Claim 2 (depends on 1) The memory card of claim 1 wherein the interposer surrounds the controller. ### Claim 3 (depends on 1) The memory card of claim 1 wherein the interposer is on top of the controller. ### Claim 4 (depends on 2) The memory card of claim 2 which includes a second memory die coupled to the interposer and a spacer for separating the memory die from the second memory die. ### Claim 5 (depends on 1) The memory card of claim 1 wherein the interposer includes at least one connecting trace. ### Claim 6 (depends on 2) The memory card of claim 2 wherein the interposer includes a cut out in a middle area large enough to accommodate the controller die. ### Claim 7 (depends on 1) The memory card of claim 1 wherein the interposer comprises a serpentine flexible memory on die member. ### Claim 8 (depends on 2) The memory card of claim 2 wherein a height of the controller die is minimized based upon the interposer surrounding the controller die. ### Claim 9 (depends on 4) The memory card of claim 4 wherein the height of the spacer is a function of a wire distance between the bond pad of the interposer and bond pads of the memory die. ### Claim 10 A Flash memory card comprising: a substrate, the substrate including a first plurality of bonding pads; a first Flash memory die on top of the substrate, the first flash memory die including a second plurality of bonding pads that are located in proximity to the first, plurality of bonding pads; a Flash controller die on top of the first Flash memory die, the flash controller die including a third plurality of bonding pads; a serpentine interposer coupled on top of the first Flash memory die, the serpentine interposer includes a fourth plurality of bonding pads that are located in proximity to the first, second and third plurality of bonding pads to allow for wire connections therebetween, wherein the serpentine interposer allows for wire bonding to the substrate to be minimized; and a least one other Flash memory die; wherein the Flash memory die is coupled to the serpentine interposer; and a spacer for separating the first Flash memory die from the second Flash memory die. ### Claim 11 (depends on 10) The memory card of claim 10 wherein the serpentine interposer includes at least one connecting trace. ### Claim 12 (depends on 10) The memory card of claim 10 wherein the serpentine interposer includes a cut out in a middle area large enough to accommodate the Flash controller die.