# US 7,411,280 B2 · Chip support of a leadframe for an integrated circuit package

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- Number: US 7,411,280 B2
- Document ID: US7411280B2
- Status: Granted
- Kind: B2
- Application number: 11/364,457
- Filed: 2006-02-28
- Published: 2006-06-29
- Granted: 2008-08-12
- Earliest claimed: 2003-08-29
- Assignees: Infineon Technologies AG
- Inventors: Mohamad B Wagiman Yazid; Pauline Low Min Wee
- Web page: https://patentgrep.com/patent/US7411280B2

## CPC

- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 72/075: {of bond wires}
- H10W 72/07554: {changes in dispositions}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/5475: {multiple bond wires connected to common bond pads at both ends of the wires}
- H10W 72/5525: {comprising copper [Cu]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/127: {characterised by arrangements for sealing or adhesion}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The central region of a leadframe (101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101, 1201), is selectively etched to leave upright portions (104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204). Subsequently, during the packaging process, an integrated circuit (3) is located on the central region of the leadframe, and wires (107) are formed between the upright portions of the leadframe and contacts (5) of the integrated circuit (3), which are to be grounded. Subsequently, the wires and upright portions of the leadframe are encased in resin (116). Since the upright portions of the leadframe are encased in resin, the resin (116) is mechanically locked to the leadframe. Furthermore, any delamination that occurs between the resin (116) and the leadframe cannot propagate easily up the sides of the upright portions as far as the wires (107), so the wires (107) are unlikely to be torn from the upright portions (104, 204, 304, 404, 504, 604, 704, 804, 904, 1004, 1104, 1204). Any adhesive that leaks from under the integrated circuit (3) when the integrated circuit (3) is mounted on the leadframe, is most unlikely to cover any part of the upper surface of the upright portions.

## Claims

### Claim 1

An integrated circuit package, comprising:
a leadframe including a central portion formed of conductive material, the central portion comprising a die pad area for attachment of an integrated circuit, and one or more upright portions;
an integrated circuit located at the die pad area, wherein the one or more upright portions of the leadframe are electrically connected to contacts of the integrated circuit that are grounded;
wire bonds between at least one electrical contact of the integrated circuit and a respective contact on the upright portions; and
a resin body encapsulating the wire bonds.

### Claim 2 (depends on 1)

The integrated circuit package according to claim 1, in which upper surfaces of the upright portions of the leadframe are plated with silver.

### Claim 3 (depends on 1)

The integrated circuit package according to claim 1, in which each of the upright portions are located at, or proximate to, one of the lateral sides of the central portion of the leadframe.

### Claim 4 (depends on 3)

The integrated circuit package according to claim 3, in which the upright portions of the leadframe which are at, or proximate to, at least one of the sides of the leadframe are in one or more groups, the upright portions of each group being at the same respective distance from the sides of the leadframe.

### Claim 5 (depends on 3)

The integrated circuit package according to claim 3, in which each of the upright portions at, or proximate to, at least one of the sides of the leadframe, extend continuously along at least half of the length of that side.

### Claim 6 (depends on 5)

The integrated circuit package according to claim 5, in which the upright portions extend continuously along substantially the entire periphery of the central portion.

### Claim 7

A method of forming a component, the method comprising:
selectively etching one surface of a central conductive portion of a leadframe to form upright portions, each with a top surface, on a die pad area of the leadframe; and
providing a layer of a conductive material on the top surface of the upright portions.

### Claim 8 (depends on 7)

The method of claim 7, further comprising:
placing an integrated circuit on the die pad area of the leadframe;
forming wires between one or more electrical contacts of the integrated circuit and the upright portions of the leadframe; and
encapsulating the integrated circuit, wires and the upright portions of the leadframe.

### Claim 9 (depends on 8)

The method of claim 8, wherein encapsulating the integrated circuit, wires and the upright portions of the leadframe comprises encapsulating the integrated circuit, wires and the upright portions of the leadframe in a resin body.

### Claim 10 (depends on 8)

The method of claim 8, wherein providing a layer of a conductive material comprises plating upper surfaces of the upright portions of the leadframe are plated with silver.

### Claim 11 (depends on 7)

The method of claim 7, wherein encapsulating the integrated circuit, wires and the upright portions of the leadframe comprises encapsulating the integrated circuit, wires and the upright portions of the leadframe in a resin body.

### Claim 12 (depends on 7)

The method of claim 7, wherein providing a layer of a conductive material comprises plating upper surfaces of the upright portions of the leadframe are plated with silver.

### Claim 13

A leadframe for packaging an integrated circuit, the leadframe comprising:
a central portion formed of conductive material, the central portion of the leadframe including a die pad area for attachment of an integrated circuit;
one or more upright pedestals formed on the die pad area; and
contacts on the leadframe.

### Claim 14 (depends on 13)

The leadframe according to claim 13, wherein the contacts of the leadframe are grounded.

### Claim 15 (depends on 13)

The leadframe according to claim 13, in which the pedestals comprise a top surface, the top surface being plated with a conductive material.

### Claim 16 (depends on 13)

The leadframe according to claim 13, in which the pedestals are located at, or proximate to, edges of the central portion.

### Claim 17 (depends on 16)

The leadframe according to claim 16, in which the pedestals are in one or more groups, the pedestals of each group being at the same respective distance from the edges of the central portion, while each group is located at a different distance from the edges of the central portion.

### Claim 18 (depends on 16)

The leadframe according to claim 16, in which each of the pedestals extend continuously along at least half of the length of the edge of the central portion.

### Claim 19 (depends on 16)

The leadframe according to claim 16, in which the pedestals extend continuously along substantially the entire periphery of the central portion.