# US 7,411,230 B2 · Solid-state imaging device and method of manufacturing said solid-state imaging device

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- Number: US 7,411,230 B2
- Document ID: US7411230B2
- Status: Granted
- Kind: B2
- Application number: 11/404,898
- Filed: 2006-04-17
- Published: 2006-08-24
- Granted: 2008-08-12
- Earliest claimed: 2002-04-22
- Assignees: FUJIFILM Corporation
- Inventors: Hiroshi Maeda; Kazuhiro Nishida; Yoshihisa Negishi; Shunichi Hosaka
- Web page: https://patentgrep.com/patent/US7411230B2

## CPC

- H10F 39/811: {Interconnections}
- H10F 39/026: {Wafer-level processing}
- H10F 39/15: Charge-coupled device [CCD] image sensors
- H10F 39/80: {Constructional details of image sensors}
- H10F 39/804: {Containers or encapsulations}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

## Claims

### Claim 1

A solid-state imaging device comprising:
a semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein the translucent member constitutes an optical member having a condensing function,
wherein the translucent member is connected to the semiconductor substrate through a spacer, and
wherein the spacer is constituted by the same material as that of the semiconductor substrate.

### Claim 2

A solid-state imaging device comprising:
a semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein the translucent member constitutes an optical member having a condensing function,
wherein the translucent member is connected to the semiconductor substrate through a spacer, and
wherein the spacer is constituted by a 42-alloy or silicon.

### Claim 3

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member having a condensing function which is connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate constituting a peripheral circuit is provided on the first semiconductor substrate,
wherein the translucent member is connected to the first semiconductor substrate through a spacer, and
wherein the spacer is constituted by the same material as that of the first semiconductor substrate.

### Claim 4

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate,
wherein the first and second semiconductor substrates are bonded to each other with an adhesive layer in between.

### Claim 5

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate.
wherein the first and second semiconductor substrates are bonded to each other with a heat insulating material in between.

### Claim 6

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate,
wherein the first and second semiconductor substrates are bonded to each other with a magnetic shield material in between.

### Claim 7

A solid-state imaging device comprising:
a semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein the translucent member constitutes an optical member having a condensing function, and
wherein a peripheral edge portion of the translucent member is substantially aligned with a peripheral edge portion of the semiconductor substrate.

### Claim 8

A solid-state imaging device comprising:
a semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein the translucent member constitutes an optical member having a condensing function,
further comprising a bonding pad formed between the translucent member and the semiconductor substrate.

### Claim 9

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member having a condensing function which is connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate constituting a peripheral circuit is provided on the first semiconductor substrate, and
wherein a peripheral edge portion of the translucent member is substantially aligned with a peripheral edge portion of the first semiconductor substrate.

### Claim 10

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member having a condensing function which is connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate constituting a peripheral circuit is provided on the first semiconductor substrate,
further comprising a bonding pad formed between the translucent member and the first semiconductor substrate.

### Claim 11

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate, and
wherein a peripheral edge portion of the translucent member is substantially aligned with a peripheral edge portion of the first semiconductor substrate.

### Claim 12

A solid-state imaging device comprising:
a first semiconductor substrate provided with an IT-CCD; and
a translucent member connected to the first semiconductor substrate in order to have a gap opposite to a light receiving region of the IT-CCD,
wherein a second semiconductor substrate having a peripheral circuit formed thereon is provided on a surface opposed to a surface of the first semiconductor substrate on which the IT-CCD is to be formed, and
the peripheral circuit is connected to the IT-CCD via a through hole provided on the first semiconductor substrate,
further comprising a bonding pad formed between the translucent member and the first semiconductor substrate.