# US 7,411,190 B2 · Inspection system, inspection method, and process management method

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 7,411,190 B2
- Document ID: US7411190B2
- Status: Granted
- Kind: B2
- Application number: 11/450,459
- Filed: 2006-06-12
- Published: 2006-10-19
- Granted: 2008-08-12
- Earliest claimed: 2003-09-10
- Assignees: Hitachi High-Technologies Corporation
- Inventors: Hiroshi Makino; Hisaya Murakoshi; Hiroyuki Shinada; Hideo Todokoro
- Web page: https://patentgrep.com/patent/US7411190B2

## CPC

- H01J 37/292: {using scanning ray}
- G01N 23/04: and forming images of the material
- H01J 2237/2817: Pattern inspection
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)

## Abstract

An inspection apparatus comprising an electron emitting unit for sequentially emitting an electron beam in the direction of an inspection area of a sample; a deceleration unit for drawing back the electron beam in the vicinity of the inspection area; an imaging unit for forming images of the drawing back electron beam on multiple different image forming conditions; an image detecting unit for capturing the electron beam that formed an image corresponding to each image forming condition; and an image processing unit for comparing the images on different image forming conditions with one another to detect a defect in the inspection area.

## Claims

### Claim 1

An inspection apparatus comprising:
a sample stage that mounts a sample to be inspected;
an electron optical system which directs electrons to the sample;
a power supply capable of applying a voltage to the sample stage thereby to draw back the electron beam incident on the sample;
an imaging optical system that detects images of the drawn back electron beam with a plurality of image forming conditions; and
an image processing unit that calculates a difference image of images obtained with the plurality of image forming conditions;
wherein the sample is inspected based on the difference image.

### Claim 2 (depends on 1)

An inspection apparatus according to claim 1,
wherein the imaging optical system includes a plurality of detecting planes of the drawn back electron beam.

### Claim 3 (depends on 1)

An inspection apparatus according to claim 1, further comprising:
a database that stores the difference image.

### Claim 4 (depends on 1)

An inspection apparatus according to claim 1,
wherein the difference image is calculated as a two-dimensional brightness map.

### Claim 5 (depends on 1)

An inspection apparatus according to claim 1,
wherein images with the plurality of image forming conditions are obtained by detecting the drawn back electron beam with different focusing conditions.

### Claim 6 (depends on 5)

An inspection apparatus according to claim 5,
wherein the imaging optical system includes a variable-focus lens composed of electrostatic lenses.