# US 7,411,135 B2 · Contour structures to highlight inspection regions > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,411,135 B2 - Document ID: US7411135B2 - Status: Granted - Kind: B2 - Application number: 10/711,885 - Filed: 2004-10-12 - Published: 2006-04-13 - Granted: 2008-08-12 - Earliest claimed: 2004-10-12 - Assignees: International Business Machines Corporation - Inventors: Timothy H. Daubenspeck; Jeffrey P. Gambino; Christopher D. Muzzy; Wolfgang Sauter - Web page: https://patentgrep.com/patent/US7411135B2 ## CPC - H10W 46/00: Marks applied to devices, e.g. for alignment or identification - H10P 74/235: {comprising optical enhancement of defects or not-directly-visible states} - H10P 74/273: {Interconnections for measuring or testing, e.g. probe pads} - H10P 74/277: {Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers} - H10W 72/012: {of bump connectors, dummy bumps or thermal bumps} - H10W 46/603: {Formed on wafers or substrates before dicing and remaining on chips after dicing} - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/019: {of bond pads} - H10W 72/075: {of bond wires} - H10W 72/251: {Materials} - H10W 72/29: Bond pads specially adapted therefor - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/923: {Bond pads having multiple stacked layers} - H10W 72/951: {Materials of bond pads} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 72/983: {Reinforcing structures, e.g. collars} - Y10T 29/49155: Manufacturing circuit on or in base - Y10T 29/49165: by forming conductive walled aperture in base - Y10T 29/49204: Contact or terminal manufacturing - Y10T 29/49227: Insulator making - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An integrated circuit has a wiring layer below an insulator layer. A pad comprises a conductive material that is on the insulator layer. The pad has a wirebond connection region and a probe pad region. An inspection mark is between the wirebond connection region and the probe pad region. The inspection mark comprises an opening in the insulator layer that is filled with the conductive material. In addition, a contact that is through the insulator layer is adapted to electrically connect the conductor wire in the wiring layer to the pad. The contact is formed of the same conductive material used for the pad and the inspection mark. ## Claims ### Claim 1 An integrated circuit structure including a portion of a conductive layer, said portion of a conductive layer comprising: a wire bond region; a probe pad region in which a probe mark is located, said probe mark including a visible area of damage; and an inspection mark including a contour structure that is topographically visible for inspection and that marks a boundary between said wire bond region and said probe pad region. ### Claim 2 (depends on 1) The integrated circuit structure in claim 1, all the limitations of which are incorporated herein by reference, further comprising a passivation layer above said portion of a conductive layer, said passivation layer including an opening though which said portion of a conductive layer is visible for inspection. ### Claim 3 (depends on 1) The integrated circuit structure in claim 1, all the limitations of which are incorporated herein by reference, further comprising an insulating layer underlying said portion of a conductive layer, wherein an inspection mark opening is formed in said insulating layer, and wherein said contour structure of said portion of a conductive layer overlies said inspection mark opening. ### Claim 4 (depends on 1) The integrated circuit structure in claim 1, all the limitations of which are incorporated herein by reference, wherein said portion of a conductor layer comprises a refractory metal. ### Claim 5 (depends on 1) The integrated circuit structure in claim 1, all the limitations of which are incorporated herein by reference, wherein said portion of a conductor layer comprises of aluminum, tantalum, and titanium. ### Claim 6 (depends on 1) The integrated circuit structure of claim 1, all the limitations of which are incorporated herein by reference, further comprising a connecting wire bonded to said wire bond region via a solder ball. ### Claim 7 An integrated circuit structure comprising: a wiring layer including a conductor wire; an insulator layer, including an inspection mark opening, on said wiring layer; a conductive layer on said insulator layer, wherein said conductive layer includes a topographical contour that overlies said inspection mark opening; and a passivation layer on said conductive layer, said passivation layer including an opening through which a portion of said conductive layer including said topographical contour that overlies said inspection mark opening is visible for inspection, wherein said topographical contour delineates said portion of said conductive layer visible for inspection into a wire bond region and a probe pad region, and wherein said probe pad region includes a visible area of damage. ### Claim 8 (depends on 7) The integrated circuit structure in claim 7, all the limitations of which are incorporated herein by reference, wherein said inspection mark opening is formed above an insulating region of said wiring layer. ### Claim 9 (depends on 7) The integrated circuit structure in claim 7, all the limitations of which are incorporated herein by reference, wherein said conductor comprises a refractory metal. ### Claim 10 (depends on 7) The integrated circuit structure in claim 7, all the limitations of which are incorporated herein by reference, wherein said conductor comprises any of aluminum, tantalum, and titanium. ### Claim 11 (depends on 7) The integrated circuit structure in claim 7, all the limitations of which are incorporated herein by reference, further comprising an insulating layer underlying said portion of a conductive layer, wherein an inspection mark opening is formed in said insulating layer, and wherein said contour structure of said portion of a conductive layer overlies said inspection mark opening. ### Claim 12 (depends on 7) The integrated circuit structure of claim 7, all the limitations of which are incorporated herein by reference, further comprising a connecting wire is bonded to said wire bond region via a solder ball. ### Claim 13 An integrated circuit structure comprising: a wiring layer below said insulator layer said wiring layer comprising including a conductor wire; an insulator layer, including a wiring contact opening and an inspection mark opening, on said wiring layer; a conductive layer on said insulator layer, wherein said conductive layer includes a first topographical contour that overlies said wiring contact opening and a second topographical contour that overlies said inspection mark opening; and a passivation layer on said conductive layer, said passivation layer including an opening through which a portion of said conductive layer including said second topographical contour that overlies said inspection mark opening is visible for inspection, wherein said second topographical contour delineates said portion of said conductive layer visible for inspection into a wire bond region and a probe pad region, and wherein said probe pad region includes a visible area of damage. ### Claim 14 (depends on 13) The integrated circuit structure in claim 13, all the limitations of which are incorporated herein by reference, wherein said inspection mark opening is formed above an insulating region of said wiring layer. ### Claim 15 (depends on 13) The integrated circuit structure in claim 13, all the limitations of which are incorporated herein by reference, wherein said conductor comprises a refractory metal. ### Claim 16 (depends on 13) The integrated circuit structure in claim 13, all the limitations of which are incorporated herein by reference, wherein said conductor comprises any of aluminum, tantalum, and titanium. ### Claim 17 (depends on 13) The integrated circuit structure in claim 13, all the limitations of which are incorporated herein by reference, further comprising an insulating layer underlying said portion of a conductive layer, wherein an inspection mark opening is formed in said insulating layer, and wherein said contour structure of said portion of a conductive layer overlies said inspection mark opening. ### Claim 18 (depends on 13) The integrated circuit structure of claim 13, all the limitations of which are incorporated herein by reference, further a connecting wire is bonded to said wire bond region via a solder ball.