# US 7,410,880 B2 · Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,410,880 B2 - Document ID: US7410880B2 - Status: Granted - Kind: B2 - Application number: 11/020,554 - Filed: 2004-12-27 - Published: 2006-06-29 - Granted: 2008-08-12 - Earliest claimed: 2004-12-27 - Assignees: ASML Netherlands B.V. - Inventors: Keith Frank Best; Joseph J. Consolini; Alexander Friz - Web page: https://patentgrep.com/patent/US7410880B2 ## CPC - B81C 99/004: {during manufacturing} - H10P 74/277: {Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers} - H10W 72/30: Die-attach connectors - H10W 90/00: Package configurations - H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects} - H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In a method for measuring the bonding quality of bonded substrates, such as bonded SOI wafers, a plurality of marks are created at a first side of a top substrate after, or before, the bonding of the top substrate onto a bottom substrate. Then, the positions of the plurality of marks are measured using a metrology tool. Next, for each of the marks, a difference between a measured position and an expected position is calculated. These differences can be used to determine delamination between the top substrate and the bottom substrate. By displaying a vector field representing the differences, and by not showing vectors that exceed a certain threshold, the delamination areas can be made visible. ## Claims ### Claim 1 A method of measuring bonding quality of a bonded substrate having a top substrate on top of a bottom substrate, the method comprising: creating a plurality of marks at a first side of the top substrate; bonding the top substrate onto the bottom substrate to form the bonded substrate; measuring positions of the plurality of marks; calculating for each of the plurality of marks, a difference between a measured position and an expected position; and determining delamination areas at an interface between the top substrate and the bottom substrate using the calculated difference. ### Claim 2 (depends on 1) A method according to claim 1, wherein the first side of the top substrate is facing the bottom substrate after bonding and wherein the plurality of marks are created before the top substrate and the bottom substrate are bonded. ### Claim 3 (depends on 1) A method according to claim 1, wherein the first side of the top substrate is a top surface of the top substrate that is not facing the bottom substrate after bonding, and wherein the plurality of marks are created after the top substrate and the bottom substrate are bonded. ### Claim 4 (depends on 3) A method according to claim 3, further comprising: providing a resist layer on top of the bonded substrate; and creating the plurality of marks in the resist layer. ### Claim 5 (depends on 1) A method according to claim 1, wherein at least one global alignment mark is arranged at the interface between the top substrate and the bottom substrate, the at least global alignment mark being used to align the bonded substrate to a nominal grid. ### Claim 6 (depends on 1) A method according to claim 1, further comprising constructing a vector field, the vector field comprising vectors corresponding to the calculated differences between the measured positions and the expected positions of each of the marks. ### Claim 7 (depends on 6) A method according to claim 6, wherein determining delamination areas comprises determining which vectors have a magnitude exceeding a threshold value. ### Claim 8 A method of producing a device from a bonded substrate having a top substrate on top of a bottom substrate, the method comprising: creating a plurality of marks at a first side of the top substrate; bonding the top substrate onto the bottom substrate to form the bonded substrate; measuring positions of the plurality of marks; calculating for each of the plurality of marks, a difference between a measured position and an expected position; determining delamination areas at an interface between the top substrate and the bottom substrate using the calculated difference; determining whether the bonded substrate meets a predetermined quality criteria, and if not, rejecting the bonded substrate, and if so, projecting a patterned beam of radiation onto a target portion of the bonded substrate. ### Claim 9 (depends on 8) A method according to claim 8, wherein the first side of the top substrate is facing the bottom substrate after bonding and wherein the plurality of marks are created before the top substrate and the bottom substrate are bonded. ### Claim 10 (depends on 8) A method according to claim 8, wherein the first side of the top substrate is a top surface of the top substrate that is not facing the bottom substrate after bonding and wherein the plurality of marks are created after the top substrate and the bottom substrate are bonded. ### Claim 11 (depends on 10) A method according to claim 10, further comprising: providing a resist layer on top of the bonded substrate; and creating the plurality of marks in the resist layer. ### Claim 12 (depends on 8) A method according to claim 8, wherein at least one global alignment mark is arranged at the interface between the top substrate and the bottom substrate, the at least global alignment mark being used to align the bonded substrate to a nominal grid. ### Claim 13 (depends on 8) A method according to claim 8, further comprising constructing a vector field, the vector field comprising vectors corresponding to the calculated differences between the measured positions and the expected positions of each of the marks. ### Claim 14 (depends on 13) A method according to claim 13, wherein determining delamination areas comprises determining which vectors have a magnitude exceeding a threshold value.