# US 7,410,838 B2 · Fabrication methods for memory cells

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- Number: US 7,410,838 B2
- Document ID: US7410838B2
- Status: Granted
- Kind: B2
- Application number: 10/834,012
- Filed: 2004-04-29
- Published: 2005-11-03
- Granted: 2008-08-12
- Earliest claimed: 2004-04-29
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Kern-Huat Ang
- Web page: https://patentgrep.com/patent/US7410838B2

## CPC

- H10B 20/10: ROM devices comprising bipolar components
- H10B 20/25: One-time programmable ROM [OTPROM] devices, e.g. using electrically-fusible links
- H10B: ELECTRONIC MEMORY DEVICES

## Abstract

A memory cell and a method of fabricating the same. A first conductive layer on a substrate is provided and a first type doped semiconductor layer is then formed on the first conductive layer. The first type doped semiconductor layer and the first conductive layer are patterned into a first line. A dielectric layer is formed on the substrate with an opening exposing the first line. A column comprising a second diode component, a buffer layer, and an anti-fuse layer is formed in the opening. A second line is formed connecting the column on the dielectric layer running generally perpendicularly to the first line.

## Claims

### Claim 1

A method for fabricating a memory cell, comprising:
forming a first conductive line and a first diode component on a substrate sequentially;
forming a dielectric layer on the substrate covering the first conductive line and the first diode component;
etching the dielectric layer to create an opening exposing the first diode component;
forming a stack filling the opening, comprising a second diode component, a buffer layer and an anti-fuse layer; and
forming a second conductive line on the dielectric layer, connecting the stack and generally perpendicularly to the first conductive line,
wherein the dielectric layer is formed before the stack of the second diode component, the buffer layer and the anti-fuse layer is filled, and
wherein the stack is formed by the steps of:
oxidizing a surface of the first diode component to create an oxide layer to act as the anti-fuse layer;
filling the opening with silicon to form a silicon column contacting the anti-fuse layer; and
performing an ion implantation to the silicon column to form a heavily doped upper portion of the silicon column as the buffer layer and a lightly doped lower portion of the silicon column as the second diode component.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the first and/or second conductive layer comprise a TiN barrier layer and a tungsten layer.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the first diode component comprises p-type doped silicon and the second diode component comprises n-type doped silicon.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the anti-fuse layer comprises an insulating layer formed on the buffer layer in contact with the second conductive line, or beneath the second diode component in contact with the first diode component.

### Claim 5

A method for fabricating a memory cell, comprising:
forming a first conductive line in a first dielectric layer on a substrate, exposing a surface of the first conductive line;
forming a first column comprising a first diode component on the exposed first conductive layer;
forming a second dielectric layer covering the first dielectric layer and the first conductive line and the first diode component;
etching the second dielectric layer to create an opening exposing the first diode component;
forming a second column filling the opening, comprising a second diode component, a buffer layer and an anti-fuse layer; and
forming a second conductive line on the second dielectric layer, connecting the second column and generally perpendicularly to the first conductive line,
wherein the second dielectric layer is formed before the second column of the second diode component, the buffer layer and the anti-fuse layer is filled, and
wherein the second diode component and the buffer layer are formed by the steps of:
oxidizing a surface of the first diode component to create an oxide layer to act as the anti-fuse layer;
filling the opening with silicon to form a silicon column contacting the anti-fuse layer; and
performing an ion implantation on the silicon column to form a heavily doped upper portion of the silicon column as the buffer layer and a lightly doped lower portion of the silicon column as the second diode component.

### Claim 6 (depends on 5)

The method according to claim 5, wherein the first and/or second conductive line comprise a TiN barrier layer and a tungsten layer.

### Claim 7 (depends on 5)

The method according to claim 5, wherein the first diode component comprises p-type doped silicon and the second diode component comprises n-type doped silicon.

### Claim 8 (depends on 5)

The method according to claim 5, wherein the anti-fuse layer comprises an insulating layer formed on the buffer layer in contact with the second conductive line, or beneath the second diode component in contact with the first diode component.