# US 7,410,831 B2 · Method and device for dividing plate-like member

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 7,410,831 B2
- Document ID: US7410831B2
- Status: Granted
- Kind: B2
- Application number: 10/555,448
- Filed: 2004-04-30
- Published: 2006-09-21
- Granted: 2008-08-12
- Earliest claimed: 2003-05-12
- Assignees: Tokyo Seimitsu Co., Ltd.
- Inventors: Yasuyuki Sakaya; Masayuki Azuma
- Web page: https://patentgrep.com/patent/US7410831B2

## CPC

- H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape}
- B23K 26/40: taking account of the properties of the material involved
- B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
- B28D 5/0011: {with preliminary treatment, e.g. weakening by scoring}
- B28D 5/0052: {Means for supporting or holding work during breaking (means for conveying work to or discharging work from the breaking machine B28D5/0058)}
- B23K 2101/40: Semiconductor devices
- B23K 2103/50: {Inorganic materials other than metals or composite materials}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B28D: WORKING STONE OR STONE-LIKE MATERIALS

## Abstract

In a method and an apparatus for dividing a plate-like member related to the present invention, multiple substrates are obtained by forming a linear modified region on a surface of a plate-like member formed from a hard and brittle material or in the interior of the plate-like member and dividing the plate-like member along this modified region. The method for dividing a plate-like member includes a tape sticking step which involves sticking tape on the surface of the plate-like member, a modified region forming step which involves forming a modified region on surface of the plate-like member or in the interior of the plate-like member, and an expanding step which involves elongating the tape by applying a tension thereto after the modified region forming step. In the expanding step, the tape is irradiated with UV rays. As a result of this, it is possible to positively manufacture an ultrathin chip with a good end-face shape in which uncut portions, chipping and breakage do not occur.

## Claims

### Claim 1

A method for dividing a plate-shaped member formed from a hard and brittle material, comprising the steps of:
sticking tape on a surface of the plate-shaped member;
forming a linear modified region on the surface of the plate-shaped member to which the tape has been stuck or in the interior thereof;
irradiating only selected portions of the tape corresponding to the peripheral edge portion of each of the chips so as to decrease adhesion of the sticking tape in the irradiated peripheral edge portion,
selectively elongating the tape near peripheral edge portions of chips which are to be cut by applying a tension thereto after forming the linear modified region while simultaneously irradiating the tape with UV rays, whereby the plate-shaped member is divided along the linear modified region thereby to obtain multiple substrates all over the surface of the wafer W without generating uncut portions.

### Claim 2 (depends on 1)

The method for dividing a plate-shaped member according to claim 1, wherein said irradiating step is performed using UV light in a pattern set using a photomask.

### Claim 3 (depends on 2)

The method for dividing a plate-shaped member according to claim 2, wherein the photomask is configured and arranged in a manner causing square-shaped light shielding portions to cover areas of the plate-shaped member that within the peripheral edge portion of each of the divided chips produced.

### Claim 4 (depends on 2)

The method for dividing a plate-shaped member according to claim 2, wherein the photomask is configured and arranged in a manner causing frame-shaped light shielding portions to cover areas of the plate-shaped member that within the peripheral edge portion of each of the divided chips produced.

### Claim 5 (depends on 1)

The method for dividing a plate-shaped member according to claim 1, wherein the step of forming a linear modified region is performed by causing laser beams to become incident on the surface of the plate-shaped member.

### Claim 6 (depends on 1)

The method for dividing a plate-shaped member according to claim 1, wherein the tape has an ultraviolet curing adhesive, and wherein the adhesive of the tape is cured and the adhesion of the tape to the plate-shaped member reduced by radiating thereof with UV rays.