# US 7,410,667 B2 · Method of applying a radiation cured resin with a transparent, removable overlay > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,410,667 B2 - Document ID: US7410667B2 - Status: Granted - Kind: B2 - Application number: 11/294,330 - Filed: 2005-12-06 - Published: 2006-06-08 - Granted: 2008-08-12 - Earliest claimed: 2004-12-06 - Assignees: Medhesives, Inc. - Inventors: Anthony R. Eisenhut; Eric D. Eisenhut - Web page: https://patentgrep.com/patent/US7410667B2 ## CPC - B29C 73/30: for local pressing or local heating - B29C 73/02: using liquid or paste-like material (B29C73/16 takes precedence) - B29C 35/0888: {using transparant moulds} - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) ## Abstract A process of using a transparent overlay device with a resin for repairing a small hole in a pipe includes applying an adhesive resin to a transparent overlay; applying the adhesive resin to a pipe surface over a hole and curing the adhesive resin through the application of a light source. ## Claims ### Claim 1 A process of using a transparent overlay device with an adhesive resin for repairing a hole in a pipe, comprising: applying an adhesive resin to a transparent overlay; applying the adhesive resin and overlay to a pipe surface over a hole; curing the adhesive resin through the application of light from a light source; and removing the overlay once the resin is cured. ### Claim 2 (depends on 1) The process according to claim 1, wherein the adhesive resin is in the form of a single component material that requires no mixing. ### Claim 3 (depends on 2) The process according to claim 2, wherein the adhesive resin is curable by radiation falling within the visible light frequency ranges. ### Claim 4 (depends on 1) The process according to claim 1, wherein the light source is an LED light source. ### Claim 5 (depends on 1) The process according to claim 1, wherein the transparent overlay is shaped and dimensioned so that it covers an area at least twice as large as the area to which the adhesive resin is to be applied. ### Claim 6 (depends on 1) The process according to claim 1, wherein the transparent overlay is composed of PCTFE. ### Claim 7 (depends on 1) The process according to claim 1, wherein an effective radiation intensity for curing is at least 2.5 mw/cm2. ### Claim 8 (depends on 1) The process according to claim 1, wherein the adhesive resin is sensitive to light at 470 nm wavelengths. ### Claim 9 (depends on 1) The process according to claim 1, wherein the adhesive resin is a radiation cured material based on free-radical polymerization or cationic polymerization. ### Claim 10 (depends on 9) The process according to claim 9, wherein the adhesive resin includes materials selected from the group consisting of: methyl methacrylate, butyl acrylate, hydroxyethylacrylate, methyl acrylate, ethyl acrylate, isopropyl acrylate, n-butyl acrylate, s-butyl acrylate, t-butyl acrylate, 2-ethylhexyl acrylate, cyclohexyl acrylate, 3,3,5-trimethycyclohexyl acrylate, 2-methoxyethyl acrylate, 2-ethylhexyl acrylate, 2-butoxyethyl acrylate, acrylonitrile, methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, s-butyl methacrylate, t-butyl methacrylate, n-hexyl methacrylate, n-octyl methacrylate, lauryl methacrylate, tridecyl methacrylate, stearyl methacrylate, phenyl methacrylate, cyclohexyl methacrylate, 3,3,5-trimethylcyclohexyl methacrylate, isobornyl methacrylate, bromoethyl methacrylate, 2-hydroxyethyl methacrylate, hydroxypropyl methacrylate, glycidyl methacrylate, methoxyethyl methacrylate, ethoxyethyl methacrylate, diethyl methyleneglutarate, isocyanatoethyl methacrylate, methacrylic acid, methacrylonitrile, 2-(diethylphosphato)ethyl methacrylate, 1-diethylphosphonoethyl methacrylate, ethylene, butadiene, vinylidene chloride, and n-vinylpyrrolidinone. ### Claim 11 (depends on 1) The process according to claim 1, wherein the adhesive resin has a viscosity between approximately 84,000 cP to 168,000 cP. ### Claim 12 (depends on 1) The process according to claim 1, wherein the adhesive resin has a specific gravity greater than water. ### Claim 13 A process of using a transparent overlay device with an adhesive resin for repairing a hole in a pipe, comprising: applying a single component adhesive resin to a transparent overlay; applying the adhesive resin and overlay to a pipe surface over a hole; curing the adhesive resin through the application of light from a light source within the visible light frequency range; and removing the overlay once the resin is cured. ### Claim 14 (depends on 13) The process according to claim 13, wherein the light source is an LED light source. ### Claim 15 (depends on 13) The process according to claim 13, wherein the transparent overlay is shaped and dimensioned so that it covers an area at least twice as large as the area to which the adhesive resin is to be applied. ### Claim 16 (depends on 13) The process according to claim 13, wherein the transparent overlay is composed of PCTFE. ### Claim 17 (depends on 13) The process according to claim 13, wherein an effective radiation intensity for curing is at least 2.5 mw/cm2. ### Claim 18 (depends on 13) The process according to claim 13, wherein the adhesive resin is sensitive to light at 470 nm wavelengths. ### Claim 19 (depends on 13) The process according to claim 13, wherein the adhesive resin is a radiation cured material based on free-radical polymerization or cationic polymerization.